参数资料
型号: MAX15112EVKIT#
厂商: Maxim Integrated Products
文件页数: 2/23页
文件大小: 0K
描述: EVAL KIT STEP-DOWN 12A MAX15112
产品培训模块: Obsolescence Mitigation Program
标准包装: 1
主要目的: DC/DC,步降
输出及类型: 1,非隔离
功率 - 输出: 18W
输出电压: 1.5V
电流 - 输出: 12A
输入电压: 2.7 V ~ 5.5 V
稳压器拓扑结构: 降压
频率 - 开关: 1MHz
板类型: 完全填充
已供物品:
已用 IC / 零件: MAX15112
MAX15112
High-Efficiency, 12A, Current-Mode Synchronous
Step-Down Regulator with Integrated Switches
ABSOLUTE MAXIMUM RATINGS
IN, PGOOD to GND ................................................-0.3V to +6V
EN, COMP, FB, SS/REFIN, GSNS, SKIP,
LX to GND ..............................................-0.3V to (V IN + 0.3V)
LX to GND (for 10ns)........................................-2V to (V IN + 2V)
LX to GND (for 50ns)........................................-1V to (V IN + 1V)
BST to LX.................................................................-0.3V to +6V
BST to GND ...........................................................-0.3V to +12V
BST to IN .................................................................-0.3V to +6V
LX Continuous Current (Note 1) ......................................... Q 20A
Output Short-Circuit Duration ...................................Continuous
Continuous Power Dissipation
WLP (derate 53.85mW/ N C above +70 N C)......................2.15W
Operating Temperature Range .......................... -40 N C to +85 N C
Junction Temperature (Note 2) .......................................+110 N C
Storage Temperature Range............................ -65 N C to +150 N C
Bump Reflow Temperature (Note 3) ...............................+260 N C
Note 1: LX has internal clamp diodes to GND and IN. Applications that forward bias these diodes must take care not to exceed
the IC’s package power dissipation limits.
Note 2: Limit the junction temperature to +110 N C for continuous operation at maximum output current.
Note 3: The WLP package is constructed using a unique set of package techniques that impose a limit on the thermal profile the
device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder pro-
files recommended in the industry-standard specification JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection
reflow. Preheating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 4)
WLP
Junction-to-Ambient Resistance ( B JA ) ……………..25.5 N C/W
Junction-to-Board Thermal Resistance ( B JB )………18.5 N C/W
Note 4: Package thermal resistances were obtained using the MAX15112 evaluation board.
DC ELECTRICAL CHARACTERISTICS
(V IN = 5V, see the Typical Operating Circuits , T A = -40 N C to +85 N C. Typical values are at T A = +25 N C, unless otherwise noted.) (Note 5)
PARAMETER
IN Voltage Range
IN Supply Current
IN Shutdown Current
IN Undervoltage Lockout
Threshold
SYMBOL
V IN
I IN
I SHDN
V UVLO
CONDITIONS
V EN = V IN , V FB = 0.65V, no switching
V EN = 0V
V IN rising, LX starts switching
MIN
2.7
TYP
4.6
0.01
2.6
MAX
5.5
7
3
2.68
UNITS
V
mA
F A
V
IN Undervoltage Lockout
Threshold Hysteresis
V IN falling, LX stops switching
200
mV
ERROR AMPLIFIER
Transconductance
Voltage Gain
g M
A VEA
1.1
90
mS
dB
FB Setpoint Voltage
FB Input Bias Current
V FB
I FB
Over line, load, and temperature
V FB = 0.6V
0.594
-500
0.600
0.606
+500
V
nA
COMP to Current-Sense
Transconductance
COMP Clamp Low Voltage
Slope Compensation Ramp
Amplitude
g MC
V SLOPE
V FB = 0.65V, V SS/REFIN = 0.6V
80
0.91
130
A/V
V
mV
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