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参数资料
| 型号： | MAX1595EUA33+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 2/7页 |
| 文件大小： | 0K |
| 描述： | IC REG MULTI CONFIG 3.3V 8UMAX |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 类型： | 降压（降压），升压（升压），切换电容（充电泵） |
| 输出类型： | 固定 |
| 输出数： | 1 |
| 输出电压： | 3.3V |
| 输入电压： | 1.8 V ~ 5.5 V |
| 频率 - 开关： | 1MHz |
| 电流 - 输出： | 125mA |
| 同步整流器： | 无 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 8-uMAX |
Regulated 3.3V/5.0V Step-Up/
Step-Down Charge Pump
ABSOLUTE MAXIMUM RATINGS
IN, OUT, AOUT to GND............................................-0.3V to +6V
SHDN to PGND ........................................................-0.3V to +6V
PGND to GND .......................................................-0.3V to +0.3V
CXN to PGND.....................-0.3V to (Lower of IN + 0.8V or 6.3V)
CXP to GND ................................-0.8V to (Higher of OUT + 0.8V
or IN + 0.8V but not greater than 6V)
Continuous Output Current ...............................................150mA
Continuous Power Dissipation (T A = +70°C)
μMAX (derate 4.8mW/°C above +70°C) ..................387.8mW
TQFN-EP (derate 24.4mW/°C above +70°C) .........1951.2mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance ( θ JA )..........41°C/W
Junction-to-Case Thermal Resistance ( θ JC ).................6°C/W
μMAX
Junction-to-Ambient Thermal Resistance ( θ JA ).....206.3°C/W
Junction-to-Case Thermal Resistance ( θ JC )...............42°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
ELECTRICAL CHARACTERISTICS
(V IN = 2V for MAX1595_ _ _33, V IN = 3V for MAX1595_ _ _50, C IN = 1μF, C X = 0.22μF, C OUT = 1μF, T A = -40° to +85°C, unless otherwise
noted. Typical values are at T A = +25°C.) (Note 2)
PARAMETER
Input Voltage Range
Input Undervoltage Lockout
Threshold
SYMBOL
V IN
CONDITIONS
MIN
1.8
1.40
TYP
1.60
MAX
5.5
1.72
UNITS
V
V
Input Undervoltage Lockout
Hysteresis
40
mV
0 < I LOAD < 125mA,
V IN = +3.0V
T A = 0 ° C to +85 ° C
T A = -40 ° C to +85 ° C
4.85
4.80
5.05
5.15
5.20
T A = -40 ° C to +85 ° C
Output Voltage
V OUT
0 < I LOAD < 75mA, V IN T A = 0 ° C to +85 ° C
= +2.0V
3.20
3.16
3.33
3.40
3.44
V
0 < I LOAD < 30mA, V IN T A = 0 ° C to +85 ° C
3.20
3.33
3.40
= +1.8V
T A = -40 ° C to +85 ° C
3.16
3.44
No-Load Input Current
I Q
V IN = +2.0V, MAX1595_ _ _33
V IN = +3.0V, MAX1595_ _ _50
220
240
320
350
μA
Switching Frequency
f OSC
I LOAD > 20mA, V OUT > V IN
0.85
1.0
1.15
MHz
Shutdown Supply Current
SHDN Input Voltage Low
SHDN Input Voltage High
SHDN Input Leakage Current
I SHDN
V INL
V INH
V SHDN = 0V, V IN = +5.5V, V OUT = 0V
V IN = 2.0V to 5.5V
V IN = 2.0V to 5.5V
1.6
5
0.6
0.1
μA
V
V
μA
Note 2: Specifications to -40 ° C are guaranteed by design, not production tested.
2
_______________________________________________________________________________________
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