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参数资料
| 型号： | MAX16021LTEY+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 2/21页 |
| 文件大小： | 0K |
| 描述： | IC SUPERVISOR PP 2.192V 16TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 类型： | 简单复位/加电复位 |
| 监视电压数目： | 1 |
| 输出： | 推挽式，图腾柱 |
| 复位： | 高有效/低有效 |
| 复位超时： | 最小 145 ms |
| 电压 - 阀值： | 2.192V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-WQFN 裸露焊盘 |
| 供应商设备封装： | 16-TQFN-EP（4x4） |
| 包装： | 带卷 (TR) |
Low-Power μP Supervisory Circuits with
Battery-Backup Circuit and Chip-Enable Gating
ABSOLUTE MAXIMUM RATINGS
V CC , BATT, OUT, BATT_TEST to GND.....................-0.3V to +6V
RESET , RESET, PFO , BATTOK, WDO , BATTON,
BATT_TEST, LL , (all open-drain) to GND .................-0.3V to +6V
RESET , RESET, BATTOK, WDO , BATTON,
LL (all push-pull) to GND......................-0.3V to (V OUT + 0.3V)
WDI, PFI to GND.......................................-0.3V to (V OUT + 0.3V)
CE IN, CE OUT to GND ..............................-0.3V to (V OUT + 0.3V)
MR to GND .................................................-0.3V to (V CC + 0.3V)
Input Current
V CC Peak Current.................................................................1A
V CC Continuous Current ...............................................250mA
BATT Peak Current .......................................................500mA
BATT Continuous Current ...............................................70mA
Output Current
OUT Short Circuit to GND Duration ....................................10s
RESET , RESET, BATTON ....................................................20mA
Continuous Power Dissipation (T A = +70°C)
10-Pin TDFN (derate 24.4mW/°C above +70°C) .......1951mW
16-Pin TQFN (derate 25mW/°C above +70°C) ..........2000mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow)
TDFN ............................................................................+260°C
TQFN............................................................................+240°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Junction-to Ambient Thermal Resistance ( θ JA ) ...........41°C/W
Junction-to Case Thermal Resistance ( θ JC ) ..................9°C/W
TQFN
Junction-to Ambient Thermal Resistance ( θ JA ) ...........40°C/W
Junction-to Case Thermal Resistance ( θ JC ) ..................6°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
ELECTRICAL CHARACTERISTICS
(V CC = 1.53V to 5.5V, V BATT = 3V, T A = -40°C to +85°C, unless otherwise noted. Typical values are at T A = +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Operating Voltage Range (Note 3)
V CC, V BATT V CC or V BATT > V TH
V CC = 1.62V
0
1.2
5.5
2
V
Supply Current
I CC
V CC > V TH
V CC = 2.8V
V CC = 3.6V
1.9
2.3
3
3.5
μA
V CC = 5.5V
3.4
5
Supply Current in
Battery-Backup Mode
V CC Switchover Threshold Voltage
BATT Switchover Threshold
Voltage
BATT Standby Current
BATT Freshness Leakage Current
I BATT
V CC = 0V
V CC rising, V CC - V BATT
V CC falling, V CC < V TH , V CC - V BATT
V CC > V BATT + 0.2V
V BATT = 5.5V
-10
0.25
0.1
x V CC
0
0.5
+10
20
μA
V
mV
nA
nA
V CC = 4.75V, I OUT = 150mA
1.4
4.5
V CC to OUT On-Resistance
R ON
V CC = 3.15V, I OUT = 65mA
V CC = 2.35V, I OUT = 25mA
1.7
2.1
4.5
5.0
?
V CC = 1.91V, I OUT = 10mA
2.6
5.5
Output Voltage in
Battery-Backup Mode
V OUT
V BATT = 4.5V, I OUT = 20mA
V BATT = 2.5V, I OUT = 20mA
V BATT - 0.1
V BATT - 0.15
V
2
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX16021LTEZ+ | 功能描述:监控电路 uPwr w/Bat-Backup 2.323V RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX16021LTEZ+T | 功能描述:监控电路 uPwr w/Bat-Backup 2.323V RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX16021PTEL+ | 功能描述:监控电路 uPwr w/Bat-Backup 4.6894V RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX16021PTEL+T | 功能描述:监控电路 uPwr w/Bat-Backup 4.6894V RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX16021PTEM+ | 功能描述:监控电路 uPwr w/Bat-Backup 4.428V RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
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