参数资料
型号: MAX16038
厂商: Maxim Integrated Products, Inc.
英文描述: Low-Power Battery Backup Circuits in Small レDFN Packages
中文描述: 低功耗电池备份电路,采用微型µDFN封装
文件页数: 9/21页
文件大小: 228K
代理商: MAX16038
M
Low-Power Battery Backup
Circuits in Small μDFN Packages
_______________________________________________________________________________________
9
Detailed Description
The Typical Operating Circuit shows a typical connec-
tion for the MAX16033–MAX16040. OUT powers the
static random-access memory (SRAM). If V
CC
is
greater than the reset threshold (V
TH
), or if V
CC
is lower
than V
TH
but higher than V
BATT
, V
CC
is connected to
OUT. If V
CC
is lower than V
TH
and V
CC
is less than
V
BATT
, BATT is connected to OUT. OUT supplies up to
200mA from V
CC
. In battery-backup mode, an internal
MOSFET connects the backup battery to OUT. The on-
resistance of the MOSFET is a function of the backup-
battery voltage and temperature and is shown in the
BATT-to-OUT On-Resistance vs. Temperature graph in
the Typical Operating Characteristics
Chip-Enable Signal Gating
(MAX16033–MAX16036 Only)
The MAX16033–MAX16036 provide internal gating of
chip-enable (
CE
) signals to prevent erroneous data
from being written to CMOS RAM in the event of a
power failure or brownout condition. During normal
operation, the
CE
gate is enabled and passes all
CE
transitions. When reset asserts, this path becomes
disabled, preventing erroneous data from corrupting
the CMOS RAM. The MAX16033–MAX16036 provide a
series transmission gate from
CE
IN to
CE
OUT. A 2ns
(typ) propagation delay from
CE
IN to
CE
OUT allows
these devices to be used with most μPs and high-
speed DSPs.
When
RESET
is deasserted,
CE
IN is connected to
CE
OUT through a low on-resistance transmission gate.
If
CE
IN is high when
RESET
is asserted,
CE
OUT
remains high regardless of any subsequent transitions
on
CE
IN during the reset event.
If
CE
IN is low when
RESET
is asserted,
CE
OUT is held
low for 1μs to allow completion of the read/write opera-
tion (Figure 1). After the 1μs delay expires,
CE
OUT
goes high and stays high regardless of any subsequent
transitions on
CE
IN during the reset event. When
CE
OUT is disconnected from
CE
IN,
CE
OUT is actively
pulled up to OUT.
The propagation delay through the chip-enable circuit-
ry depends on both the source impedance of the drive
to
CE
IN and the capacitive loading at
CE
OUT. The
chip-enable propagation delay is specified from the
50% point of
CE
IN to the 50% point of
CE
OUT, using a
50
driver and 50pF load capacitance. Minimize the
capacitive load at
CE
OUT and use a low output-imped-
ance driver to minimize propagation delay.
In high-impedance mode, the leakage current at
CE
IN
is ±1μA (max) over temperature. In low-impedance
mode, the impedance of
CE
IN appears as a 75
resis-
tor in series with the load at
CE
OUT.
V
CC
V
TH
t
RD
t
RD
t
RP
t
RP
CEIN
CEOUT
RESET
PFO
PFI > V
PFI
RESET-TO-CEOUT DELAY
*
*
IF CEIN GOES HIGH BEFORE RESET ASSERTS,
CEOUT GOES HIGH WITHOUT DELAY AS CEIN GOES HIGH.
Figure 1.
RESET
and Chip-Enable Timing
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MAX16038LLA23+ 制造商:Maxim Integrated Products 功能描述:- Rail/Tube
MAX16038LLA23+T 功能描述:监控电路 Battery Backup 2.5V-Ep RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟(典型值):10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel
MAX16038LLA26+ 制造商:Maxim Integrated Products 功能描述:VOLT SUPERVISOR MONITOR 2.63V 8PIN UDFN - Rail/Tube
MAX16038LLA26+T 功能描述:监控电路 Battery Backup 2.63V RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟(典型值):10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel
MAX16038LLA29+ 制造商:Maxim Integrated Products 功能描述:VOLT SUPERVISOR MONITOR 2.93V 8PIN UDFN - Rail/Tube