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参数资料
| 型号： | MAX1607ETB+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 7/10页 |
| 文件大小： | 0K |
| 描述： | IC USB SWITCH CURR LIMIT 10TDFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 类型： | USB 开关 |
| 输出数： | 1 |
| Rds（开）： | 90 毫欧 |
| 内部开关： | 是 |
| 电流限制： | 700mA |
| 输入电压： | 2.7 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-WFDFN 裸露焊盘 |
| 供应商设备封装： | 10-TDFN-EP（3x3） |
| 包装： | 带卷 (TR) |
USB Current-Limited Switch
in Pin-Compatible Package
counter starts. If the load fault persists beyond the
10ms overcurrent-blanking timeout, the OC output
asserts low. Ensure that the MAX1607 input is ade-
quately bypassed to prevent input glitches from trigger-
ing spurious OC outputs. Input voltage glitches less
than 150mV will not cause a spurious OC output. Load-
transient faults less than 10ms (typ) will not cause an
OC output assertion.
Only current-limit faults are blanked. Die overtempera-
ture faults and input voltage droops below the UVLO
threshold will cause an immediate OC output.
Applications Information
Input Capacitor
To limit the input voltage drop during momentary output
short-circuit conditions, connect a capacitor from IN to
GND. A 1μF ceramic capacitor will be adequate for
most applications; however, higher capacitor values will
further reduce the voltage drop at the input (Figure 2).
Output Capacitor
Connect a 0.1μF capacitor from OUT to GND. This
capacitor helps to prevent inductive parasitics from
pulling OUT negative during turn-off.
Layout and Thermal Dissipation
Important: Optimize the switch response time to output
short-circuit conditions by keeping all traces as short
as possible to reduce the effect of undesirable parasitic
inductance. Place input and output capacitors as close
as possible to the device (no more than 5mm away). All
IN and OUT pins must be connected with short traces
to the power bus. Wide power-bus planes will provide
superior heat dissipation through the MAX1607’s IN
and OUT pins.
Under normal operating conditions, the package can
dissipate and channel heat away. Calculate the maxi-
mum power dissipation as follows:
P = (I LIMIT ) 2 ? R ON
where I LIMIT is the preset current limit (1.0A max) and
R ON is the on-resistance of the switch (125m Ω max).
When the output is short circuited, foldback-current lim-
iting activates and the voltage drop across the switch
equals the input supply. The power dissipated across
the switch increases, as does the die temperature. If
the fault condition is not removed, the thermal-over-
load-protection circuitry activates (see Thermal
Shutdown section). Wide power-bus planes connected
to IN and OUT and a ground plane in contact with the
device will help dissipate additional heat.
Pin Configurations (continued)
INPUT
1 μ F
IN
OUT
OUTPUT
0.1 μ F*
TOP VIEW
100k
MAX1607
10
9
8
7
6
OVERCURRENT
OUTPUT
OFF
OC
MAX1607
ON
EN
+
EP*
GND
1
2
3
4
5
*USB SPECIFICATIONS REQUIRE
A HIGHER VALUE CAPACITOR.
Figure 2. Typical Application Circuit
*EP = EXPOSED PADDLE
TRANSISTOR COUNT: 715
Chip Information
_______________________________________________________________________________________
7
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