参数资料
型号: MAX16126TCA+
厂商: Maxim Integrated Products
文件页数: 2/19页
文件大小: 0K
描述: IC LOAD DUMP REV V PROT 12TQFN
产品培训模块: Obsolescence Mitigation Program
标准包装: 100
应用: 负载突降,电压保护
电流 - 电源: 224µA
电源电压: 3 V ~ 30 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 12-WFQFN 裸露焊盘
供应商设备封装: 12-TQFN 裸露焊盘(3x3)
包装: 管件
MAX16126/MAX16127
Load-Dump/Reverse-Voltage Protection Circuits
ABSOLUTE MAXIMUM RATINGS
(All pins referenced to GND.)
IN ............................................................................-36V to +90V
SHDN ............................................-0.3V to max (0V, V IN + 0.3V)
TERM ............................................-0.3V to max (0V, V IN + 0.3V)
SRC, GATE .............................................................-36V to +45V
SRC to GATE ..........................................................-36V to +36V
OUT .......................................................................-0.3V to +45V
FLAG .....................................................................-0.3V to +45V
Continuous Sink/Source (all pins) ................................. Q 100mA
Continuous Power Dissipation (T A = +70 N C) (multilayer board)
TQFN (derate 14.7mW/ N C above +70 N C)...............1176.5mW
Operating Temperature Range ........................ -40 N C to +125 N C
Junction Temperature .....................................................+150 N C
Storage Temperature Range............................ -60 N C to +150 N C
Lead Temperature (soldering, 10s) ................................+300 N C
Soldering Temperature (reflow) ......................................+260 N C
OVSET, UVSET ........................................................-0.3V to +6V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance ( B JA ) ..........68 N C/W
Junction-to-Case Thermal Resistance ( B JC ) ...............11 N C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial .
ELECTRICAL CHARACTERISTICS
(V IN = 12V, C GATE-SOURCE = 1nF, T A = -40 N C to +125 N C, unless otherwise noted. Typical values are at T A = +25 N C.) (Note 2)
PARAMETER
Input Voltage Range
SYMBOL
V IN
CONDITIONS
Operating range
Protection range
MIN
3
-36
TYP
MAX
30
+90
UNITS
V
Input Supply Current
I IN
SHDN = high
V IN = V SRC =
V OUT = 12V
V IN = V SRC =
V OUT = 30V
224
260
320
350
F A
SHDN = low
V IN = 12V
V IN = 30V
34
64
50
100
SRC Input Current
IN Undervoltage Lockout
OVSET/UVSET Input Current
I SRC
V UVLO
I UVSET/OVSET
V SRC = V IN = 12V , SHDN = high
V SRC = V IN = 30V , SHDN = high
V IN rising
136
240
200
350
2.92
100
F A
V
nA
OVSET/UVSET Threshold (Rising)
V TH
V IN rising
1.2
1.225
1.25
V
OVSET/UVSET Threshold Hysteresis
POK Threshold Rising
POK Threshold Falling
V TH-HYS
V POK+
V POK-
0.05 x
V TH
0.9 x V IN
0.87 x V IN
V
V
V
TERM On-Resistance
R TERM
0.7
1.2
k I
Maxim Integrated
2
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