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参数资料
| 型号： | MAX16818ETI+T |
| 厂商： | Maxim Integrated |
| 文件页数： | 24/25页 |
| 文件大小： | 0K |
| 描述： | IC LED DRIVR PWM CONTROL 28-TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 拓扑： | 高端，低端，PWM，SEPIC，降压（降压），升压（升压） |
| 输出数： | 1 |
| 内部驱动器： | 无 |
| 类型 - 主要： | 车载，背光 |
| 类型 - 次要： | 高亮度 LED（HBLED） |
| 频率： | 125kHz ~ 1.5MHz |
| 电源电压： | 4.75 V ~ 5.5 V，7 V ~ 28 V |
| 输出电压： | 5.1V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-WFQFN 裸露焊盘 |
| 供应商设备封装： | 28-TQFN-EP（5x5） |
| 包装： | 带卷 (TR) |
| 工作温度： | -40°C ~ 85°C |
1.5MHz, 30A High-Efficiency, LED Driver
with Rapid LED Current Pulsing
PCB Layout Guidelines
Use the following guidelines to layout the switching volt-
age regulator:
1) Place the IN, V CC , and V DD bypass capacitors
TOP VIEW
Pin Configuration
close to the MAX16818.
21
20
19
18
17
16
15
2) Minimize the area and length of the high current
loops from the input capacitor, upper switching
MOSFET, inductor, and output capacitor back to
the input capacitor negative terminal.
SGND
SENSE-
SENSE+
22
23
24
14
13
12
LIM
V_IOUT
RT/SYNC
3) Keep short the current loop formed by the lower
switching MOSFET, inductor, and output capacitor.
SGND
IN
25
26
MAX16818
11
10
EN
PGOOD
4) Place the Schottky diodes close to the lower
MOSFETs and on the same side of the PCB.
5) Keep the SGND and PGND isolated and connect
them at one single point.
V CC
V DD
27
28
+
1
* EXPOSED PAD
2 3
4
5
6
7
9
8
CLKOUT
SGND
6) Run the current-sense lines CSP and CSN very
close to each other to minimize the loop area.
Similarly, run the remote voltage-sense lines
SENSE+ and SENSE- close to each other. Do not
cross these critical signal lines through power cir-
cuitry. Sense the current right at the pads of the
current-sense resistors.
7) Avoid long traces between the V DD bypass capaci-
tors, the driver output of the MAX16818, the MOS-
FET gates, and PGND. Minimize the loop formed by
the V CC bypass capacitors, bootstrap diode, boot-
strap capacitor, the MAX16818, and the upper
MOSFET gate.
8) Distribute the power components evenly across the
board for proper heat dissipation.
9) Provide enough copper area at and around the
TQFN
Chip Information
TRANSISTOR COUNT: 5654
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages .
switching MOSFETs, inductor, and sense resistors
to aid in thermal dissipation.
10) Use wide copper traces (2oz) to keep trace induc-
PACKAGE TYPE
28 TQFN
PACKAGE CODE
T2855-3
DOCUMENT NO.
tance and resistance low to maximize efficiency.
Wide traces also cool heat-generating components.
24
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| MAX1681C/D | 功能描述:直流/直流开关转换器 125mA High-Speed Switched-Capacitor Voltage Converters RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT |
| MAX1681ESA | 功能描述:直流/直流开关转换器 125mA f-Select Swtcd Voltage Converter RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT |
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