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参数资料
| 型号： | MAX16821AATI+ |
| 厂商： | Maxim Integrated |
| 文件页数： | 22/24页 |
| 文件大小： | 0K |
| 描述： | IC LED DRIVR HIGH BRIGHT 28-TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 60 |
| 拓扑： | 高端，低端，PWM，SEPIC，降压（降压），升压（升压） |
| 输出数： | 1 |
| 内部驱动器： | 无 |
| 类型 - 主要： | 车载，背光 |
| 类型 - 次要： | 高亮度 LED（HBLED） |
| 频率： | 125kHz ~ 1.5MHz |
| 电源电压： | 4.75 V ~ 5.5 V，7 V ~ 28 V |
| 输出电压： | 5.1V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-WFQFN 裸露焊盘 |
| 供应商设备封装： | 28-TQFN-EP（5x5） |
| 包装： | 管件 |
| 工作温度： | -40°C ~ 125°C |
High-Power Synchronous HBLED
Drivers with Rapid Current Pulsing
PCB Layout
Use the following guidelines to layout the LED driver.
Selector Guide
1) Place the IN, V CC , and V DD bypass capacitors
close to the MAX16821A/MAX16821B/MAX16821C.
2) Minimize the area and length of the high-current
switching loops.
3) Place the necessary Schottky diodes that are con-
nected across the switching MOSFETs very close to
the respective MOSFET.
PART
MAX16821A
MAX16821B
MAX16821C
DIFFERENTIAL
SET VALUE
(V SENSE+ - V SENSE- )
(V)
0.60
0.10
0.03
DIFFERENTIAL
AMP GAIN
(V/V)
1
6
20
4) Use separate ground planes on different layers of
the PCB for SGND and PGND. Connect both of
these planes together at a single point and make
this connection under the exposed pad of the
MAX16821A/MAX16821B/MAX16821C.
5) Run the current-sense lines CSP and CSN very
close to each other to minimize the loop area. Run
TOP VIEW
Pin Configuration
the sense lines SENSE+ and SENSE- close to each
other. Do not cross these critical signal lines with
21
20
19
18
17
16
15
power circuitry. Sense the current right at the pads
of the current-sense resistors. The current-sense
signal has a maximum amplitude of 27.5mV. To pre-
vent contamination of this signal from high dv/dt
and high di/dt components and traces, use a
ground plane layer to separate the power traces
from this signal trace.
6) Place the bank of output capacitors close to the load.
7) Distribute the power components evenly across the
SGND 22
SENSE- 23
SENSE+ 24
SGND 25
IN 26
V CC 27
V DD 28
+
MAX16821A
MAX16821B
MAX16821C
*EP
14
13
12
11
10
9
8
I.C.
OUTV
RT/SYNC
EN
MODE
CLKOUT
SGND
board for proper heat dissipation.
8) Provide enough copper area at and around the
1
2
3
4
5
6
7
switching MOSFETs, inductor, and sense resistors
to aid in thermal dissipation.
9) Use 2oz or thicker copper to keep trace inductances
and resistances to a minimum. Thicker copper con-
ducts heat more effectively, thereby reducing thermal
impedance. Thin copper PCBs compromise efficiency
in applications involving high currents.
*EP = EXPOSED PAD.
PROCESS: BiCMOS
TQFN
Chip Information
22
______________________________________________________________________________________
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX16821AATI+ | 功能描述:LED照明驱动器 Synchronous HB w/Rapid Current Puls RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| MAX16821AATI+T | 功能描述:LED照明驱动器 Synchronous HB w/Rapid Current Puls RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| MAX16821BATI+ | 功能描述:LED照明驱动器 Synchronous HB w/Rapid Current Puls RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| MAX16821BATI+T | 功能描述:LED照明驱动器 Synchronous HB w/Rapid Current Puls RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| MAX16821BATI+TW | 功能描述:LED照明驱动器 High-Power Synchronous HBLED Drivers with Rapid Current Pulsing RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
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