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参数资料
| 型号： | MAX16839ATT+T |
| 厂商： | Maxim Integrated |
| 文件页数： | 6/11页 |
| 文件大小： | 0K |
| 描述： | IC LED DRIVER 100MA 6-TDFN |
| 其它有关文件： | Automotive Product Guide |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 恒定电流： | 是 |
| 拓扑： | 线性，开路漏极，PWM |
| 输出数： | 1 |
| 内部驱动器： | 是 |
| 类型 - 主要： | 车载 |
| 类型 - 次要： | 高亮度 LED（HBLED） |
| 电源电压： | 5 V ~ 40 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-WDFN 裸露焊盘 |
| 供应商设备封装： | 6-TDFN 裸露焊盘（3x3） |
| 包装： | 带卷 (TR) |
| 工作温度： | -40°C ~ 125°C |
High-Voltage, Linear High-Brightness LED
Driver with Open-LED Fault Detect
Typical Operating Characteristics (continued)
(V IN = 12V, R CS = 4.07 I from CS to GND, C FLTS = 0.1 F F, C IN = 0.1 F F, DIM input unconnected, T A = +25 N C, unless otherwise noted.
Typical values are at T A = +25 N C.)
FAULT INTEGRATION ON OPEN LED
(100Hz, 50% DUTY CYCLE AT DIM)
MAX16839 toc15a
100Hz AT DIM
FAULT INTEGRATION ON OPEN LED
(100Hz, 75% DUTY CYCLE AT DIM)
MAX16839 toc15b
FAULT INTEGRATION ON OPEN LED
WITH SUPPLY CHOPPING
MAX16839 toc16
V FLT
V DIM
5V/div
2V/div
V FLT
V DIM
5V/div
2V/div
V CS
200mV/div
V IN
5V/div
V FLTS
5V/div
I LED
4ms/div
500mA/div
I LED
100μs/div
500mA/div
200 F s/div
Pin Description
PIN
TDFN
1
SO
1
NAME
IN
FUNCTION
Positive Input Supply. Bypass with a 10nF (typ) capacitor to GND.
Dimming Input. Drive DIM high or leave unconnected to turn on the LED current-sink driver.
2
2
DIM
Drive DIM low to turn off the LED current-sink driver. In multiple LED-string applications, connect
all DIM inputs together to synchronize the LED current-sink turn-on.
LED Fault Memory. Connect a 0.1 F F to 10 F F capacitor from FLTS to ground. In multiple LED-
3
3
FLTS
string applications, connect all FLTS pins together to have all strings latch off if one of them
opens (see Figure 2). Connect FLTS to ground to disable fault protection.
4
5
6
—
—
6
7
8
4, 5
—
GND
CS
SINK
N.C.
EP
Ground
Current-Sense Input. Connect a current-sense resistor between CS and GND to program the
output current level.
LED Driver Current-Sink Output
No Connection. Not internally connected.
Exposed Pad. Connect EP to a large-area contiguous copper ground plane for effective power
dissipation. Do not use as the only IC ground connection. EP must be connected to GND.
6
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