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参数资料
| 型号： | MAX16839EVKIT+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 2/11页 |
| 文件大小： | 0K |
| 描述： | KIT EVAL FOR MAX16839 |
| 其它有关文件： | Automotive Product Guide |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 1 |
| 电流 - 输出 / 通道： | 100mA |
| 输出及类型： | 3，非隔离 |
| 特点： | PWM 控制 |
| 输入电压： | 5 ~ 40 V |
| 已供物品： | 板 |
| 已用 IC / 零件： | MAX16839 |
High-Voltage, Linear High-Brightness LED
Driver with Open-LED Fault Detect
ABSOLUTE MAXIMUM RATINGS
(Voltages are specified with respect to GND.)
IN, SINK.................................................................-0.3V to +45V
FLTS ......................................................................-0.3V to +18V
DIM ..........................................................................-0.3V to +6V
CS .........................................................................-0.3V to +0.5V
Operating Temperature Range ........................ -40 N C to +125 N C
Junction Temperature .....................................................+150 N C
Storage Temperature Range............................ -65 N C to +150 N C
Lead Temperature (soldering, 10s) ................................+300 N C
Soldering Temperature (reflow) ......................................+260 N C
Continuous Current into SINK and CS .............................120mA
Continuous Power Dissipation (T A = +70 N C)
6-Pin TDFN (derate 23.8mW/ N C above +70 N C) .....1904.8mW
8-Pin SO (derate 18.9mW/ N C above +70 N C)..........1509.4mW
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance ( B JA ) ..........42 N C/W
Junction-to-Case Thermal Resistance ( B JC ) ..................... 9 N C/W
SO
Junction-to-Ambient Thermal Resistance ( B JA ) ..........53 N C/W
Junction-to-Case Thermal Resistance ( B JC ) .................5 N C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
ELECTRICAL CHARACTERISTICS
(V IN = 12V, V FLTS = 0V, R CS = 4.07 I , V GND = 0V, DIM = unconnected, C IN = 0.1 F F (Note 2), T J = T A = -40 N C to +125 N C, unless
otherwise noted. Typical values are at T A = +25 N C.) (Note 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage Range
Quiescent Current
V IN
I IN
5
0.25
40
0.6
V
mA
Undervoltage Lockout
UVLO Hysteresis
V UVLO
V IN rising
3.6
0.3
V
V
CS REGULATOR
T A = +25 N C
195.5
203
210.5
CS Voltage Accuracy
CS Load Regulation
V CS
-40 N C P T A P +125 N C, 0.9V P V SINK P 5.5V
(Note 4)
20mA P I SINK P 100mA
193
40
213
mV
F V/mA
Internal Switch On-Resistance
R DS_ON
(Note 5)
2
4
I
LED CURRENT TRANSIENT RESPONSE
LED Current Turn-On Delay
LED Current Turn-On Delay
Relative to DIM
LED Current Turn-Off Delay
Relative to DIM
LED Current Rise Time
LED Current Fall Time
t DIN
t DDIN
t r
t f
30% of V IN rising edge to 50% of I SINK ,
V DIM = 2.1V (Notes 6, 7)
V DIM rising edge to 50% of I SINK
V DIM falling edge to 50% of I SINK
10% of I SINK to 90% of I SINK
90% of I SINK to 10% of I SINK
4
2.3
1.3
2.5
2.5
9
5.5
3.5
5.5
6
F s
F s
F s
F s
F s
2
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