参数资料
型号: MAX16903SATB33/V+T
厂商: Maxim Integrated Products
文件页数: 3/14页
文件大小: 0K
描述: IC REG BUCK SYNC 3.3V 1A 10TDFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
类型: 降压(降压)
输出类型: 固定
输出数: 1
输出电压: 3.3V
输入电压: 3.5 V ~ 28 V
PWM 型: 电流模式
频率 - 开关: 2.1MHz
电流 - 输出: 1A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 10-WFDFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 10-TDFN-EP(3x3)
MAX16903
2.1MHz, High-Voltage, 1A Mini-Buck Converter
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND.)
SUP, EN..................................................................-0.3V to +42V
BST to LX..................................................................-0.3V to +6V
LX..............................................................-0.3V to (V SUP + 0.3V)
BST .........................................................................-0.3V to +47V
OUTS ......................................................................-0.3V to +12V
SYNC, PGOOD, BIAS............................................-0.3V to +6.0V
PGND to GND .......................................................-0.3V to +0.3V
LX Continuous RMS Current .................................................1.5A
OUTS Short-Circuit Duration ......................................Continuous
ESD Protection
Human Body Model .........................................................±2kV
Machine Model ..............................................................±200V
Continuous Power Dissipation (T A = +70°C)
TDFN (derate 24.4 mW/°C above +70°C)......................1951mW
TSSOP (derate 26.1 mW/°C above +70°C) ...................2089mW
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance ( θ JA ) ...........41°C/W
Junction-to-Case Thermal Resistance ( θ JC ) ..................9°C/W
TSSOP
Junction-to-Ambient Thermal Resistance ( θ JA ) ........38.3°C/W
Junction-to-Case Thermal Resistance ( θ JC ) ..................3°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial .
ELECTRICAL CHARACTERISTICS
(V SUP = +14V, T A = T J = -40°C to +125°C, unless otherwise noted. Typical values are at T A = +25°C, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage Range
Supply Current
V SUP
I SUP
(Note 2)
t < 1s
EN = low
EN = high, no load
3.5
4
25
28
42
8
35
V
μA
EN = high, continuous, no switching
1
mA
UV Lockout
V UVLO Bias rising
V UVLO,HYS Hysteresis
2.8
3
0.4
3.2
V
Bias Voltage
V BIAS
+5.5V
V SUP
+42V
5
V
Bias Current Limit
I BIAS
10
mA
BUCK CONVERTER
V OUT,5V
V OUT = 5V, fixed frequency
V OUT = 5V, SKIP mode (Note 3)
6V V SUP 18V,
I LOAD = 0 to 1A,
-2.0%
-2.0%
5
5
+2.5%
+4%
Voltage Accuracy
V OUT,3.3V
V OUT,5V
V OUT,3.3V
V OUT = 3.3V, fixed frequency
V OUT = 3.3V, SKIP mode (Note 3)
V OUT = 5V, fixed frequency
V OUT = 5V, SKIP mode (Note 3)
V OUT = 3.3V, fixed frequency
V OUT = 3.3V, SKIP mode (Note 3)
T A = 0°C to
+125°C
6V V SUP 18V,
I LOAD = 0 to 1A,
T A = -40°C to
+125°C
-2.0%
-2.0%
-3.0%
-3.0%
-3.0%
-3.0%
3.3
3.3
5
5
3.3
3.3
+2.5%
+4%
+2.5%
+4%
+2.5%
+4%
V
Maxim Integrated
3
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