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参数资料
| 型号： | MAX17105ETG+T |
| 厂商： | Maxim Integrated |
| 文件页数： | 25/26页 |
| 文件大小： | 0K |
| 描述： | IC LED DRVR WHITE BCKLGT 24-TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 拓扑： | PWM，升压（升压） |
| 输出数： | 8 |
| 内部驱动器： | 是 |
| 类型 - 主要： | 车载，背光 |
| 类型 - 次要： | 白色 LED |
| 频率： | 500kHz ~ 2MHz |
| 电源电压： | 6 V ~ 28 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-WFQFN 裸露焊盘 |
| 供应商设备封装： | 24-TQFN-EP（4x4） |
| 包装： | 带卷 (TR) |
| 工作温度： | -40°C ~ 85°C |
8-String WLED Driver with Integrated Step-Up
Regulator and SMBus/PWM Dimming Capability
3) Create a ground island (PGND) consisting of the
input and output capacitor ground and negative
terminal of the current-sense resistor. Connect all
these together with short, wide traces or a small
ground plane. Maximizing the width of the power
ground traces improves efficiency and reduces out-
put voltage ripple and noise spikes. Create an analog
ground island (AGND) consisting of the overvoltage-
detection divider ground connection, the ISET and
DFSET resistor connections, the COMP resistor and
capacitor connections, and the device’s exposed
backside pad. Connect the AGND and PGND islands
by connecting the SGND pins directly to the exposed
backside pad. Make no other connections between
these separate ground planes.
Simplified Operating Circuit
4) Place the overvoltage-detection divider resistors as
close to the OVP pin as possible. The divider’s center
trace should be kept short. Placing the resistors far
away causes the sensing trace to become antennas
that can pick up switching noise. Avoid running the
sensing traces near LX.
5) Place the IN pin bypass capacitor as close to the
device as possible. The ground connection of the IN
bypass capacitor should be connected directly to
SGND pins with a wide trace.
6) Minimize the size of the LX node while keeping it wide
and short. Keep the LX node away from the feedback
node and ground. If possible, avoid running the LX
node from one side of the PCB to the other. Use DC
traces as a shield if necessary.
Refer to the MAX17105 evaluation kit for an example of
proper board layout.
Chip Information
PROCESS: BiCMOS
V CC
ISET
IN
FAULT
LX
Package Information
DFSET
PGND
OVP
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages .
PACKAGE TYPE
PACKAGE CODE
DOCUMENT NO.
EN
MAX17105
24 TQFN-EP
T2444-4
21-0139
OSC
COMP
SDA
SCL
FB1
FB2
FB3
10kHz
PWMI
PWM0
SGND
EP
FB4
FB5
FB6
FB7
FB8
_______________________________________________________________________________________
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX17105EVKIT+ | 功能描述:电源管理IC开发工具 MAX17105 Eval Kit RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| MAX17106ETN+ | 功能描述:PMIC 解决方案 PMIC for LCD RoHS:否 制造商:Texas Instruments 安装风格:SMD/SMT 封装 / 箱体:QFN-24 封装:Reel |
| MAX17106ETN+T | 功能描述:其他电源管理 Integrated Circuits (ICs) Power Management - Specialized - IC REG STEP UP/HV STEPUP 56-TQFN RoHS:否 制造商:Texas Instruments 输出电压范围: 输出电流:4 mA 输入电压范围:3 V to 3.6 V 输入电流: 功率耗散: 工作温度范围:- 40 C to + 110 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-48 封装:Reel |
| MAX17106EVKIT+ | 制造商:Maxim Integrated Products 功能描述:STEP-UP REGULATOR HIGH-VOLTAGE STEP-UP WITH TEMPERATURE COMP - Boxed Product (Development Kits) |
| MAX17107ETI+ | 制造商:Maxim Integrated Products 功能描述:- Rail/Tube |
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