参数资料
型号: MAX17108ETI+T
厂商: Maxim Integrated Products
文件页数: 4/5页
文件大小: 0K
描述: IC LEVEL SHIFTER 10CH 28TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
应用: LCD 电视机/监控器
安装类型: 表面贴装
封装/外壳: 28-WFQFN 裸露焊盘
供应商设备封装: 28-TQFN-EP(5x5)
包装: 带卷 (TR)
MAX17108ETI+
V. Quality Assurance Information
A. Quality Assurance Contacts:
B. Outgoing Inspection Level:
C. Observed Outgoing Defect Rate:
D. Sampling Plan:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
< 50 ppm
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as
follows:
=
1
=
1.83
(Chi square value for MTTF upper limit)
MTTF
192 x 4340 x 46 x 2
= 23.3 x 10
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 23.3 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly 1000
hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-ic.com/.
Current monitor data for the S45URS Process results in a FIT Rate of 0.9 @ 25C and 13.84 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The PF52 die type has been found to have all pins able to withstand a HBM transient pulse of +/-2500 V per
JEDEC JESD22-A114. Latch-Up testing has shown that this device withstands a current of +/-100 mA, 1.5X VCCMax
Overvoltage per JESD78.
Maxim Integrated Products. All rights reserved.
Page 4/5
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