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| 型号： | MAX17112ETB+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 12/12页 |
| 文件大小： | 0K |
| 描述： | IC CONV DC-DC STEP UP 10TDFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 1 |
| 应用： | LCD 监视器，笔记本电脑显示器 |
| 电源电压： | 2.6 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-WFDFN 裸露焊盘 |
| 供应商设备封装： | 10-TDFN-EP（3x3） |
| 包装： | 标准包装 |
| 产品目录页面： | 1412 (CN2011-ZH PDF) |
| 其它名称： | MAX17112ETB+TDKR |
High-Performance, Step-Up, DC-DC Converter
2) Create a power ground island (PGND) consisting of
the input and output capacitor grounds and GND
pins. Connect all of these together with short, wide
traces or a small ground plane. Maximizing the
width of the power ground traces improves efficien-
cy and reduces output voltage ripple and noise
spikes. Create an analog ground plane (AGND)
consisting of the feedback-divider ground connec-
tion, the COMP and SS capacitor ground connec-
tions, and the device ’s exposed backside pad.
Connect the AGND and PGND islands by connect-
ing the GND pins directly to the exposed backside
pad. Make no other connections between these
separate ground planes.
3) Place the feedback-voltage-divider resistors as close
as possible to the feedback pin. The divider’s center
trace should be kept short. Placing the resistors far
away causes the FB trace to become an antenna
that can pick up switching noise. Care should be
taken to avoid running the feedback trace near LX or
the switching nodes in the charge pumps.
Chip Information
TRANSISTOR COUNT: 4624
PROCESS: BiCMOS
4) Place IN and V L pin bypass capacitors as close as
possible to the device. The ground connections of
the IN and V L bypass capacitor should be connect-
ed directly to the AGND with a wide trace.
5) Minimize the length and maximize the width of the
traces between the output capacitors and the load
for best transient responses.
6) Minimize the size of the LX node while keeping it
wide and short. Keep the LX node away from the
feedback node and analog ground. Use DC traces
as a shield if necessary.
Refer to the MAX17112 evaluation kit for an example of
proper board layout.
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages .
PACKAGE TYPE
10 TDFN-EP
PACKAGE CODE
T1033+2
DOCUMENT NO.
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
? 2008 Maxim Integrated Products
Maxim is a registered trademark of Maxim Integrated Products, Inc.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX17112EVKIT+ | 功能描述:电源管理IC开发工具 MAX17112 Eval Kit RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| MAX17113ETL+ | 功能描述:其他电源管理 Power-Supply Controller RoHS:否 制造商:Texas Instruments 输出电压范围: 输出电流:4 mA 输入电压范围:3 V to 3.6 V 输入电流: 功率耗散: 工作温度范围:- 40 C to + 110 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-48 封装:Reel |
| MAX17113ETL+T | 功能描述:LCD 驱动器 Power-Supply Controller RoHS:否 制造商:Maxim Integrated 数位数量:4.5 片段数量:30 最大时钟频率:19 KHz 工作电源电压:3 V to 3.6 V 最大工作温度:+ 85 C 最小工作温度:- 20 C 封装 / 箱体:PDIP-40 封装:Tube |
| MAX17113EVKIT+ | 功能描述:电源管理IC开发工具 MAX17113 Eval Kit RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| MAX17114ETM | 制造商:MAXIM 功能描述:Pb Free |
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