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| 型号： | MAX1778EUG+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 32/39页 |
| 文件大小： | 0K |
| 描述： | IC DCDC CONV MULTI OUT 24TSSOP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 62 |
| 应用： | 转换器，TFT，LCD |
| 输入电压： | 2.7 V ~ 5.5 V |
| 输出数： | 5 |
| 输出电压： | 2.7 V ~ 13 V |
| 工作温度： | 0°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 24-TSSOP |
| 包装： | 管件 |
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MAX1778/MAX1880–MAX1885
Quad-Output TFT LCD DC/DC
Converters with Buffer
layer boards, the top layer should contain the boost
regulator and charge-pump power ground plane,
and the inner layer should contain the analog
ground plane and power-ground plane/path for the
VCOM buffer and LDO. Connect all three ground
planes together at one place near the PGND pin.
3) Locate all feedback resistive-dividers as close as
possible to their respective feedback pins. The volt-
age-divider’s center trace should be kept short.
Avoid running any feedback trace near the LX
switching node or the charge-pump drivers. The
resistive-dividers’ ground connections should be to
analog ground (GND).
4) When using multilayer boards, separate the top sig-
nal layer and bottom signal layer with a ground
plane between to eliminate capacitive coupling
L1
between fast-charging nodes on the top layer and
high-impedance nodes on the bottom layer. The
fast-charging nodes, such as the LX and charge-
pump driver nodes, should not have any other
traces or ground planes near by.
5) Keep the charge-pump circuitry as close as possi-
ble to the IC, using wide traces and avoiding vias
when possible. Place 0.1μF ceramic bypass
capacitors near the charge-pump input pins (SUPP
and SUPN) to the PGND pin.
6) To maximize output power and efficiency and mini-
mize output ripple voltage, use extra-wide, power-
ground traces, and solder the IC’s power-ground
pin directly to it.
Refer to the MAX1778/MAX1880–MAX1885 evaluation
kit for an example of proper board layout.
INPUT
10 μ H
MAIN
V IN = 5V
C IN
(2) 4.7 μ F
R RDY
100k ?
C1
0.22 μ F
IN
SHDN
LX
FB
R1
86.6k ?
R COMP
4.7k ?
C OUT
(2) 10 μ F
V MAIN = 12V
TO LOGIC
RDY
SUPL
SUPB
R2
10k ?
C COMP
470pF
LDO
V LDO = 3.3V
C6
1 μ F
R8
10k ?
Q1
R7
16.4k ?
C LDOOUT
4.7 μ F
C6
0.01 μ F
R8
1.5k ?
LDOOUT
MAX1778
SUPN
SUPP
DRVP
C4
0.1 μ F
750k ?
C7
0.01 μ F
NEGATIVE
V NEG = -8V
C3
1.0 μ F
C2
0.1 μ F
R5
316k ?
R6
49.9k ?
FBL
DRVN
FBN
FBP
BUFOUT
BUF-
FLTSET
R4
49.9k ?
C BUF
1.0 μ F
R3
R9
30k ?
C5
1.0 μ F
BUFFER OUTPUT
V BUFOUT = V SUPB /2
REF
POSITIVE
V POS = 20V
C REF
0.22 μ F
REF
INTG
PGND
BUF+
GND
TGND
R10
100k ?
Figure 8. 5V Input Monitor Application
32
Maxim Integrated
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX1778EUG+ | 功能描述:直流/直流开关转换器 Quad-Output TFT LCD w/Buffer RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT |
| MAX1778EUG+T | 功能描述:直流/直流开关转换器 Quad-Output TFT LCD w/Buffer RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT |
| MAX1778EUG-T | 功能描述:直流/直流开关转换器 RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT |
| MAX1778EVKIT | 功能描述:电源管理IC开发工具 MAX1778/80/81/82 Eval Kit RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| MAX1779EUE | 功能描述:直流/直流开关转换器 RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT |
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