参数资料
型号: MAX1793EUE50+T
厂商: Maxim Integrated
文件页数: 6/11页
文件大小: 0K
描述: IC REG LDO 5V/ADJ 1A 16TSSOP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
稳压器拓扑结构: 正,固定式或可调式
输出电压: 5V,1.25 V ~ 5 V
输入电压: 2.5 V ~ 5.5 V
稳压器数量: 1
电流 - 输出: 1A(最小)
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-TSSOP(0.173",4.40mm)裸露焊盘
供应商设备封装: 16-TSSOP-EP
包装: 带卷 (TR)
Low-Dropout, Low I Q , 1A Linear Regulator
Typical Operating Characteristics (continued)
(Circuit of Figure 2, V IN = +5V, V SHDN = V IN , V OUT = +3.3V, T A = +25°C, unless otherwise noted.)
SHUTDOWN RESPONSE
MAX1793 toc14
RESET OUTPUT RESPONSE
MAX1793 toc15
V OUT
V SHDN
2V/div
V IN
V OUT
RST
5V/div
2V/div
2V/div
5V/div
I OUT = 100mA
40 μ s/div
1ms/div
Pin Description
PIN
1, 8, 9, 16
2–5
6
7
10
11
12–15
NAME
N.C.
IN
RST
SHDN
GND
SET
OUT
EP
FUNCTION
No Connection. Not internally connected.
Regulator Input. Supply voltage ranges from +2.5V to +5.5V. Bypass with a 4.7μF capacitor to GND
(see the Capacitor Selection and Regulator Stability ). These inputs are internally connected, but they
also must be externally connected for proper operation.
Reset Output. Open-drain output is low when V OUT is 6% below its nominal value. RST remains low
while the output voltage (V OUT ) is below the reset threshold and for at least 4ms after V OUT rises above
the reset threshold. Connect a 100k ? pullup resister to OUT to obtain an output voltage.
Active-Low Shutdown Input. A logic-low disables the output and reduces the supply current to 0.1μA.
In shutdown, the RST output is low and OUT is pulled low through an internal 5k ? resistance. Connect
SHDN to IN for normal operation.
Ground. This pin and the exposed pad also function as a heatsink. Solder both to a large pad or to the
circuit-board ground plane to maximize power dissipation.
Voltage-Setting Input. Connect to GND to select the factory-present output voltage. Connect SET to an
external resistor-divider for adjustable-output operation.
Regulator Output. Bypass with a 6.8μF, low-ESR capacitor to GND. Connect all OUT pins together at
the IC.
Exposed Pad. Connect to the ground plane. EP also functions as a heatsink. Solder to the circuit-board
ground plane to maximize thermal dissipation.
6
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