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| 型号： | MAX1878ETC+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 2/12页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK BST SYNC ADJ 12TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 75 |
| 类型： | 降压（降压），升压（升压） |
| 输出类型： | 可调式 |
| 输出数： | 2 |
| 输出电压： | 1.25 V ~ 28 V |
| 输入电压： | 2 V ~ 5.5 V |
| PWM 型： | 电压模式 |
| 频率 - 开关： | 500kHz |
| 电流 - 输出： | 500mA |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 12-WQFN 裸露焊盘 |
| 包装： | 管件 |
| 供应商设备封装： | 12-TQFN-EP（4x4） |
Dual-Output Step-Down and LCD Step-Up
Power Supply for PDAs
ABSOLUTE MAXIMUM RATINGS
FB, FBLCD, AIN1, AIN2, ON, ONLCD to AGND ......-0.3V to +6V
AIN2 to AIN1..........................................................-0.3V to +0.3V
AIN1, AIN2 to IN ....................................................-0.3V to +0.3V
IN to PGND...............................................................-0.3V to +6V
LX to PGND .................................................-0.3V to (V IN + 0.3V)
LXLCD to PGNDLCD..............................................-0.3V to +30V
PGND, PGNDLCD to AGND..................................-0.3V to +0.3V
Continuous Power Dissipation (T A = +70°C)
12-Pin TQFN (derate 24.4mW/°C above +70°C) ...........1.95W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
LX Current .........................................................................800mA
LXLCD Current..................................................................500mA
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance ( θ JA )...............41°C/W
Junction-to-Case Thermal Resistance ( θ JC )......................6°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
ELECTRICAL CHARACTERISTICS
(V IN = V AIN = 2.5V, circuit of Figure 1, T A = 0°C to +85°C , unless otherwise noted. Typical values are at T A = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
GENERAL
Input Voltage Range
V IN , V AIN
2.0
5.5
V
Undervoltage Lockout Threshold
V UVLO
V IN rising
V IN falling
1.7
1.92
1.82
2.0
V
Undervoltage Lockout Hysteresis
100
mV
Quiescent Current
Shutdown Quiescent Current
I AIN1 +
I AIN2
V FB = V FBLCD = 1.30V, V ONLCD = 0V,
step-down converter only
V FB = V FBLCD = 1.30V
V ON = V ONLCD = 0V
19
24
0
30
38
1
μA
μA
MAIN OUTPUT (Step-Down Converter)
Output Voltage Adjustment Range
V MAIN
1.25
V IN
V
FB Regulation Voltage
FB Input Bias Current
Main Output Current
(Note 2)
V FB
I FB
I MAIN
V IN = V AIN = 2V
V IN = V AIN = 2V
V MAIN = 1.8V
T A = +25°C to +85°C
T A = 0°C to +85°C
V IN = V AIN = 2.5V
V IN = V AIN = 2.0V
1.225
1.220
250
200
1.250
10
500
350
1.275
1.280
50
V
nA
mA
Line Regulation
Load Regulation
Dropout Voltage
I LOAD = 150mA, V IN = V AIN = 2V to 3V,
FB = GND
V IN = V AIN = 2.5V, I LOAD = 10mA to 150mA
V IN = V AIN = 2V, I LOAD = 150mA,
V FB = 0.8V
V IN = V AIN = 3V, I LOAD = 150mA,
V FB = 0.8V
1
1
150
100
%
%
mV
2
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