参数资料
型号: MAX1901EAI+T
厂商: Maxim Integrated Products
文件页数: 27/33页
文件大小: 0K
描述: IC CNTRLR PWR SPLY LN 28-SSOP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,000
应用: 控制器,笔记本电脑电源系统
输入电压: 4.2 V ~ 30 V
输出数: 4
输出电压: 2.5 V ~ 5 V
工作温度: 0°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 28-SSOP(0.209",5.30mm 宽)
供应商设备封装: 28-SSOP
包装: 带卷 (TR)
500kHz Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
performance. In most applications, the circuit will be
located on a multilayer board, and full use of the four or
more copper layers is recommended. Use the top layer
for high-current connections, the bottom layer for quiet
connections (REF, SS, GND), and the inner layers for
an uninterrupted ground plane. Use the following step-
by-step guide:
1) Place the high-power components (Figure 1, C1, C3,
C4, Q1, Q2, L1, and R1) first, with their grounds
adjacent.
? Priority 1: Minimize current-sense resistor trace
lengths and ensure accurate current sensing with
Kelvin connections (Figure 9).
? Priority 2: Minimize ground trace lengths in the
high-current paths (discussed below).
? Priority 3: Minimize other trace lengths in the high
current paths.
Use >5mm-wide traces
CIN to high-side MOSFET drain: 10mm max
length
Rectifier diode cathode to low-side MOSFET:
5mm max length
LX node (MOSFETs, rectifier cathode, inductor):
15mm max length
Ideally, surface-mount power components are butted up
to one another with their ground terminals almost touch-
ing. These high-current grounds are then connected to
each other with a wide filled zone of top-layer copper so
they don ’ t go through vias. The resulting top layer “ sub-
ground-plane ” is connected to the normal inner-layer
ground plane at the output ground terminals, which
ensures that the IC ’ s analog ground is sensing at the sup-
ply ’ s output terminals without interference from IR drops
HIGH-CURRENT PATH
SENSE RESISTOR
MAX1901/MAX1902/MAX1904
Figure 9. Kelvin Connections for the Current-Sense Resistors
and ground noise. Other high-current paths should also
be minimized, but focusing primarily on short ground and
current-sense connections eliminates about 90% of all PC
board layout problems.
2) Place the IC and signal components. Keep the main
switching nodes (LX nodes) away from sensitive
analog components (current-sense traces and REF
capacitor). Place the IC and analog components on
the opposite side of the board from the power-
switching node. Important: the IC must be no more
than 10mm from the current-sense resistors. Keep
the gate-drive traces (DH_, DL_, and BST_) shorter
than 20mm and route them away from CSH_, CSL_,
and REF.
3) Use a single-point star ground where the input
ground trace, power ground (sub-ground-plane), and
normal ground plane meet at the supply ’ s output
ground terminal. Connect both IC ground pins and all
IC bypass capacitors to the normal ground plane.
______________________________________________________________________________________
27
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