参数资料
型号: MAX1931EUB+T
厂商: Maxim Integrated Products
文件页数: 7/8页
文件大小: 0K
描述: IC SW CUR LIMIT USB 10-UMAX
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
应用: USB,外设
电流 - 电源: 14µA
电源电压: 2.7 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 10-TFSOP,10-MSOP(0.118",3.00mm 宽)
供应商设备封装: 10-µMAX
包装: 带卷 (TR)
Current-Limited Switch for Single USB Port
spurious FAULT output. Load-transient faults less than
10ms (typ) do not cause a FAULT output assertion.
Only current-limit faults are blanked. Die overtempera-
ture faults and input voltage droops below the UVLO
threshold cause an immediate fault output.
Applications Information
Input Capacitor
To limit the input voltage drop during momentary output
short-circuit conditions, connect a capacitor from IN to
GND. A 1μF ceramic capacitor is adequate for most
applications; however, higher capacitor values further
reduce the voltage drop at the input (see Figure 2).
Output Capacitor
Connect a 0.1μF capacitor from OUT to GND. This cap-
acitor helps prevent inductive parasitics from pulling
OUT negative during turn-off.
Layout and Thermal Dissipation
To optimize the switch-response time to output short-
circuit conditions, it is very important to keep all traces
as short as possible to reduce the effect of undesirable
parasitic inductance. Place input and output capacitors
as close to the device as possible (no more than 5mm).
INPUT
All IN and all OUT pins must be connected with short
traces to the power bus. Wide power bus planes pro-
vide superior heat dissipation through the switch IN and
OUT pins. Figure 3 shows suggested pin connections
for a single-layer board.
Under normal operating conditions, the package can
dissipate and channel heat away. Calculate the maxi-
mum power dissipation as follows:
P = (I LIMIT ) 2 ? R ON
where I LIMIT is the preset current limit (1.1A max) and
R ON is the on-resistance of the switch (150m ? max).
When the output is short-circuited, foldback-current-lim-
iting activates and the voltage drop across the switch
equals the input supply. The power dissipated across
the switch increases, as does the die temperature. If the
fault condition is not removed, the thermal-overload pro-
tection circuitry activates (see the Thermal Shutdown
section). Wide power-bus planes connected to IN and
OUT and a ground plane in contact with the device
help dissipate additional heat.
Chip Information
TRANSISTOR COUNT: 715
2.7V TO 5.5V
IN
OUT
OUTPUT
MAX1931
1 μ F
0.1 μ F*
OFF
100k ?
FAULT
MAX1931
1
2
3
IN
OUT
IN
OUT
IN
OUT
10
9
8
ON
ON
4
OUT
FAULT
7
GND
5
ON
GND
6
*USB SPECIFICATIONS REQUIRE A LARGER CAPACITOR
Figure 2. Typical Application Circuit
Figure 3. IN and OUT Cross Connections for a Single-Layer
Board
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