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| 型号： | MAX19713ETN+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 25/37页 |
| 文件大小： | 0K |
| 描述： | IC ANLG FRONT END 45MSPS 56-TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 43 |
| 位数： | 10 |
| 通道数： | 2 |
| 功率（瓦特）： | 91.8mW |
| 电压 - 电源，模拟： | 3V |
| 电压 - 电源，数字： | 3V |
| 封装/外壳： | 56-WFQFN 裸露焊盘 |
| 供应商设备封装： | 56-TQFN-EP（7x7） |
| 包装： | 管件 |
| 产品目录页面： | 1398 (CN2011-ZH PDF) |
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capacitor in parallel with a 2.2F capacitor. Bypass REFP,
REFN, and COM each to GND with a 0.33F ceramic
capacitor. Bypass REFIN to GND with a 0.1F capacitor.
Multilayer boards with separated ground and power
planes yield the highest level of signal integrity. Use a
split ground plane arranged to match the physical loca-
tion of the analog ground (GND) and the digital output-
driver ground (OGND) on the device package. Connect
the MAX19713 exposed backside paddle to the GND
plane. Join the two ground planes at a single point so
the noisy digital ground currents do not interfere with
the analog ground plane. The ideal location for this
connection can be determined experimentally at a
point along the gap between the two ground planes.
Make this connection with a low-value, surface-mount
resistor (1
Ω to 5Ω), a ferrite bead, or a direct short.
Alternatively, all ground pins could share the same
ground plane, if the ground plane is sufficiently isolated
from any noisy digital system’s ground plane (e.g.,
downstream output buffer or DSP ground plane).
Route high-speed digital signal traces away from sensi-
tive analog traces. Make sure to isolate the analog
input lines to each respective converter to minimize
channel-to-channel crosstalk. Keep all signal lines short
and free of 90° turns.
Dynamic Parameter Definitions
ADC and DAC Static Parameter Definitions
Integral Nonlinearity (INL)
Integral nonlinearity is the deviation of the values on an
actual transfer function from a straight line. This straight
line can be either a best-straight-line fit or a line drawn
between the end points of the transfer function, once
offset and gain errors have been nullified. The static lin-
earity parameters for the device are measured using
the best-straight-line fit (DAC Figure 14a).
MAX19713
Figure 12. Rx ADC DC-Coupled Differential Drive
MAX19713
IAP
COM
IAN
RISO
22
Ω
RISO
22
Ω
R11
600
Ω
R9
600
Ω
R3
600
Ω
R2
600
Ω
R1
600
Ω
R10
600
Ω
R8
600
Ω
R5
600
Ω
R4
600
Ω
R7
600
Ω
R6
600
Ω
CIN
5pF
CIN
5pF
10-Bit, 45Msps, Full-Duplex
Analog Front-End
______________________________________________________________________________________
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX19713ETN+ | 功能描述:ADC / DAC多通道 45Msps CODEC/AFE Full Duplex RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
| MAX19713ETN+GH7 | 功能描述:ADC / DAC多通道 10-Bit 45Msps Full-Duplex Analog Front-End RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
| MAX19713ETN+T | 功能描述:ADC / DAC多通道 45Msps CODEC/AFE Full Duplex RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
| MAX19713ETN+TGH7 | 功能描述:ADC / DAC多通道 10-Bit 45Msps Full-Duplex Analog Front-End RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
| MAX19713ETN-T | 功能描述:ADC / DAC多通道 RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
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