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参数资料
| 型号： | MAX1977EEI+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 31/32页 |
| 文件大小： | 0K |
| 描述： | IC CNTRLR PS QUAD HI EFF 28QSOP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 50 |
| 应用： | 控制器，笔记本电脑电源系统 |
| 输入电压： | 4.5 V ~ 24 V |
| 输出数： | 4 |
| 输出电压： | 3.3V，5V，2 V ~ 5.5 V |
| 工作温度： | 0°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-QSOP |
| 供应商设备封装： | 28-QSOP |
| 包装： | 管件 |
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High-Efficiency, Quad Output, Main Power-
Supply Controllers for Notebook Computers
4) Make the DC-DC controller ground connections as
follows: near the device, create a small analog
ground plane. Connect the small analog ground
plane to GND (Figure 13) and use the plane for the
Pin Configurations (continued)
TOP VIEW
ground connection for the REF and V CC bypass
capacitors, FB dividers, and ILIM resistors (if any).
Create another small ground island for PGND, and
CS3 1
PGOOD 2
ON3 3
28 BST3
27 LX3
26 DH3
use the plane for the V+ bypass capacitor, placed
very close to the device. Connect the AGND and
PGND planes together at the GND pin of the device.
5) On the board’s top side (power planes), make a
star ground to minimize crosstalk between the two
sides. The top-side star ground is a star connection
of the input capacitors and synchronous rectifiers.
Keep the resistance low between the star ground
and the source of the synchronous rectifiers for
accurate current limit. Connect the top-side star
ground (used for MOSFET, input, and output
capacitors) to the small island with a single short,
wide connection (preferably just a via).
Create PGND islands on the layer just below the
ON5 4
ILIM3 5
SHDN 6
FB3 7
REF 8
FB5 9
PRO 10
ILIM5 11
SKIP 12
CS5 13
BST5 14
MAX1777
MAX1977
QSOP
25 LDO3
24 DL3
23 GND
22 OUT3
21 OUT5
20 V+
19 DL5
18 LDO5
17 V CC
16 DH5
15 LX5
top-side layer (refer to the MAX1777 EV kit for an
example) to act as an EMI shield if multiple layers
are available (highly recommended). Connect each
of these individually to the star ground via, which
connects the top side to the PGND plane. Add one
more solid ground plane under the device to act as
an additional shield, and also connect the solid
ground plane to the star ground via.
6) Connect the output power planes (V CORE and system
ground planes) directly to the output filter capacitor
positive and negative terminals with multiple vias.
Chip Information
TRANSISTOR COUNT: 8335
PROCESS: BiCMOS
______________________________________________________________________________________
31
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX1977EEI+ | 功能描述:DC/DC 开关控制器 Quad Out Main Power Supply Controller RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
| MAX1977EEI+T | 功能描述:DC/DC 开关控制器 Quad Out Main Power Supply Controller RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
| MAX1977EEI-T | 功能描述:DC/DC 开关控制器 RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
| MAX1977EEI-TG068 | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX1978ETM | 功能描述:电压模式 PWM 控制器 RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel |
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