参数资料
型号: MAX1977EEI+T
厂商: Maxim Integrated Products
文件页数: 30/32页
文件大小: 0K
描述: IC CNTRLR PS QUAD HI EFF 28QSOP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
应用: 控制器,笔记本电脑电源系统
输入电压: 4.5 V ~ 24 V
输出数: 4
输出电压: 3.3V,5V,2 V ~ 5.5 V
工作温度: 0°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 28-QSOP
供应商设备封装: 28-QSOP
包装: 带卷 (TR)
High-Efficiency, Quad Output, Main Power-
Supply Controllers for Notebook Computers
USE AGND PLANE TO:
- BYPASS V CC AND REF
USE PGND PLANE TO:
- BYPASS LDO_
- TERMINATE EXTERNAL FB
- CONNECT PGND TO THE TOPSIDE STAR GROUND
VIA TO PGND
DIVIDER (IF USED)
- TERMINATE R ILIM
(IF USED)
- PIN-STRAP CONTROL
AGND
VIA BETWEEN POWER
AND ANALOG GROUND
VIA TO OUT5
OUT5
C3
GROUND
C4
OUT3
INPUTS
PGND
VIA TO OUT3
ANALOG GROUND
PLANE ON INNER LAYER
L1
N4
C1
C2
N2
L2
VIAS TO GROUND
VIA TO LX5
N3
V+
N1
VIA TO LX3
CONNECT PGND TO AGND
BENEATH THE CONTROLLER AT
ONE POINT ONLY AS SHOWN.
Figure 13. PC Board Layout Example
NOTE: EXAMPLE SHOWN IS FOR DUAL N-CHANNEL MOSFET.
PGND5). Avoid the introduction of AC currents into
the PGND3 and PGND5 ground planes. Run the
power plane ground currents on the top side only, if
possible.
? Use a star ground connection on the power plane to
minimize the crosstalk between OUT3 and OUT5.
? Keep the high-current paths short, especially at the
ground terminals. This practice is essential for sta-
ble, jitter-free operation.
? Keep the power traces and load connections short.
This practice is essential for high efficiency. Using
thick copper PC boards (2oz vs. 1oz) can enhance
full-load efficiency by 1% or more. Correctly routing
PC board traces must be approached in terms of
fractions of centimeters, where a single milliohm of
excess trace resistance causes a measurable effi-
ciency penalty.
? CS_ (MAX1777/MAX1977) / LX_ (MAX1999) and GND
connections to the synchronous rectifiers for current
limiting must be made using Kelvin sense connec-
tions to guarantee the current-limit accuracy. With 8-
pin SO MOSFETs, this is best done by routing power
to the MOSFETs from outside using the top copper
layer, while connecting CS_/LX_ traces inside (under-
neath) the MOSFETs.
? When trade-offs in trace lengths must be made, it is
preferable to allow the inductor charging path to be
made longer than the discharge path. For example,
is better to allow some extra distance between the
input capacitors and the high-side MOSFET than to
allow distance between the inductor and the syn-
chronous rectifier or between the inductor and the
output filter capacitor.
? Ensure that the OUT_ connection to C OUT_ is short and
direct. However, in some cases it may be desirable to
deliberately introduce some trace length between the
OUT_ connector node and the output filter capacitor
(see the Stability Considerations section).
? Route high-speed switching nodes (BST_, DH_, LX_,
and DL_) away from sensitive analog areas (REF,
ILIM_, and FB_). Use PGND3 and PGND5 as an EMI
shield to keep radiated switching noise away from the
IC’s feedback divider and analog bypass capacitors.
? Make all pin-strap control input connections ( SKIP ,
ILIM_, etc.) to GND or V CC of the device.
Layout Procedure
1) Place the power components first with ground ter-
minals adjacent (N2/N4 source, C IN_ , C OUT_ , D1
anode). If possible, make all these connections on
the top layer with wide, copper-filled areas.
2) Mount the controller IC adjacent to the synchronous
rectifier MOSFETs, preferably on the back side in
order to keep DH_, GND, and the DL_ gate drive
lines short and wide. The DL_ gate trace must be
short and wide measuring 50mils to 100mils wide if
the MOSFET is 1in from the controller device.
3) Group the gate-drive component (BST_ diode and
capacitor, V+ bypass capacitor) together near the
controller device.
30
______________________________________________________________________________________
相关PDF资料
PDF描述
RSC19DRAS CONN EDGECARD 38POS R/A .100 SLD
RSM31DRMN CONN EDGECARD 62POS .156 WW
UPM1H121MPD CAP ALUM 120UF 50V 20% RADIAL
MAX1904BEAI+T IC CNTRLR PWR SPLY LN 28-SSOP
UPM1E271MPD6 CAP ALUM 270UF 25V 20% RADIAL
相关代理商/技术参数
参数描述
MAX1977EEI-TG068 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述:
MAX1978ETM 功能描述:电压模式 PWM 控制器 RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel
MAX1978ETM+ 功能描述:电压模式 PWM 控制器 Integrated Temp Ctlr for Peltier Modules RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel
MAX1978ETM+T 功能描述:电压模式 PWM 控制器 Integrated Temp Ctlr for Peltier Modules RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel
MAX1978ETM-T 功能描述:电压模式 PWM 控制器 RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel