参数资料
型号: MAX19985AETX+T
厂商: Maxim Integrated
文件页数: 2/23页
文件大小: 0K
描述: IC MIXER DOWNCONV 36-TQFN-EP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
RF 型: 手机,EDGE,GSM,iDEN,WCDMA
频率: 700MHz ~ 1GHz
混频器数目: 1
增益: 8.7dB
噪音数据: 9dB
次要属性: 降频变频器
电流 - 电源: 280mA,380mA
电源电压: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
包装: 带卷 (TR)
封装/外壳: 36-WFQFN 裸露焊盘
供应商设备封装: 36-TQFN 裸露焊盘(6x6)
Dual, SiGe, High-Linearity, 700MHz to 1000MHz
Downconversion Mixer with LO Buffer/Switch
ABSOLUTE MAXIMUM RATINGS
V CC to GND ...........................................................-0.3V to +5.5V
LO1, LO2 to GND ...............................................................±0.3V
Any Other Pins to GND...............................-0.3V to (V CC + 0.3V)
RFMAIN, RFDIV, and LO_ Input Power ..........................+15dBm
RFMAIN, RFDIV Current (RF is DC shorted
to GND through balun)....................................................50mA
θ JA (Notes 2, 3)..............................................................+38°C/W
θ JC (Note 3).....................................................................7.4°C/W
Operating Temperature Range (Note 4) .....T C = -40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Continuous Power Dissipation (Note 1) ..............................8.8W
Note 1: Based on junction temperature T J = T C + ( θ JC x V CC x I CC ). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
Note 2: Junction temperature T J = T A + ( θ JA x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Note 4: T C is the temperature on the exposed pad of the package. T A is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
+5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, V CC = 4.75V to 5.25V, T C = -40°C to +85°C. Typical values are at V CC = 5.0V, T C = +25°C, all parame-
ters are production tested, unless otherwise noted.)
PARAMETER
Supply Voltage
Supply Current
SYMBOL
V CC
I CC
CONDITIONS
MIN
4.75
TYP
5
330
MAX
5.25
380
UNITS
V
mA
LOSEL Input High Voltage
LOSEL Input Low Voltage
V IH
V IL
2
0.8
V
V
LOSEL Input Current
I IH , I IL
-10
+10
μA
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, V CC = 3.0V to 3.6V, T C = -40°C to +85°C. Typical values are at V CC = 3.3V, T C = +25°C, all parameters
are guaranteed by design and not production tested, unless otherwise noted.)
PARAMETER
Supply Voltage
Supply Current
SYMBOL
V CC
I CC
CONDITIONS
R2 = R5 = 600 Ω
Total supply current, V CC = 3.3V
MIN
3.0
TYP
3.3
280
MAX
3.6
UNITS
V
mA
LOSEL Input High Voltage
LOSEL Input Low Voltage
V IH
V IL
2
0.8
V
V
2
_______________________________________________________________________________________
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