参数资料
型号: MAX19996AETP+T
厂商: Maxim Integrated
文件页数: 2/35页
文件大小: 0K
描述: IC DOWNCONVERTER SGL 20-TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
RF 型: LTE,MMDS,WCS,WiMAX
频率: 2GHz ~ 3.9GHz
混频器数目: 1
增益: 8.3dB
噪音数据: 9.6dB
次要属性: 降频变频器
电流 - 电源: 150mA,245mA
电源电压: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
包装: 带卷 (TR)
封装/外壳: 20-WQFN 裸露焊盘
供应商设备封装: 20-TQFN-EP(5x5)
SiGe, High-Linearity, 2000MHz to 3900MHz
Downconversion Mixer with LO Buffer
ABSOLUTE MAXIMUM RATINGS
V CC to GND ...........................................................-0.3V to +5.5V
IF+, IF-, LO to GND ....................................-0.3V to (V CC + 0.3V)
RF, LO Input Power ........................................................+12dBm
RF, LO Current (RF and LO is DC shorted to GND
through a balun)...............................................................50mA
Continuous Power Dissipation (Note 1) ...............................5.0W
θ JC (Notes 1, 3)................................................................13°C/W
Operating Case Temperature
Range (Note 4).........................................T C = -40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
θ JA (Notes 2, 3)..............................................................+38°C/W
Note 1: Based on junction temperature T J = T C + ( θ JC x V CC x I CC ). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
Note 2: Junction temperature T J = T A + ( θ JA x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Note 4: T C is the temperature on the exposed pad of the package. T A is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, V CC = 4.75V to 5.25V, no input AC signals. T C = -40°C to +85°C, unless otherwise noted. Typical values
are at V CC = 5.0V, T C = +25°C, all parameters are production tested.)
PARAMETER
Supply Voltage
Supply Current
SYMBOL
V CC
I CC
CONDITIONS
MIN
4.75
TYP
5.0
230
MAX
5.25
245
UNITS
V
mA
3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, V CC = 3.0V to 3.6V, no input AC signals. T C = -40°C to +85°C, unless otherwise noted. Typical values are
at V CC = 3.3V, T C = +25°C, parameters are guaranteed by design and not production tested, unless otherwise noted.)
PARAMETER
Supply Voltage
Supply Current
SYMBOL
V CC
I CC
CONDITIONS
Total supply current, V CC = 3.3V
MIN
3.0
TYP
3.3
150
MAX
3.6
UNITS
V
mA
2
_______________________________________________________________________________________
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