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| 型号： | MAX19996ETP+ |
| 厂商： | Maxim Integrated |
| 文件页数： | 2/19页 |
| 文件大小： | 0K |
| 描述： | IC MIXER DOWNCONV 20-TQFN-EP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 60 |
| RF 型： | LTE，MMDS，WCS，WiMAX |
| 频率： | 2GHz ~ 3.0GHz |
| 混频器数目： | 1 |
| 增益： | 8.7dB |
| 噪音数据： | 9.6dB |
| 次要属性： | 降频变频器 |
| 电流 - 电源： | 149.5mA，245mA |
| 电源电压： | 3 V ~ 3.6 V，4.75 V ~ 5.25 V |
| 包装： | 管件 |
| 封装/外壳： | 20-WQFN 裸露焊盘 |
| 供应商设备封装： | 20-TQFN-EP（5x5） |
SiGe High-Linearity, 2000MHz to 3000MHz
Downconversion Mixer with LO Buffer
ABSOLUTE MAXIMUM RATINGS
V CC to GND ...........................................................-0.3V to +5.5V
IF+, IF-, LOBIAS, LO, IFBIAS,
LEXT to GND ..........................................-0.3V to (V CC + 0.3V)
RF, LO Input Power ........................................................+12dBm
RF, LO Current
(RF and LO is DC shorted to GND through a balun) ......50mA
Continuous Power Dissipation (Note 1) ..............................5.0W
θ JA (Notes 2, 3)..............................................................+38°C/W
θ JC (Notes 1, 3)................................................................13°C/W
Operating Case Temperature
Range (Note 4)........................................T C = -40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: Based on junction temperature T J = T C + ( θ JC x V CC x I CC ). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
Note 2: Junction temperature T J = T A + ( θ JA x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Note 4: T C is the temperature on the exposed pad of the package. T A is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
+5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, V CC = +4.75V to +5.25V, no input AC signals. T C = -40°C to +85°C, unless otherwise noted. Typical val-
ues are at V CC = +5.0V, T C = +25°C, all parameters are production tested.) (Note 6)
PARAMETER
Supply Voltage
Supply Current
SYMBOL
V CC
I CC
CONDITIONS
MIN
4.75
TYP
5
230
MAX
5.25
245
UNITS
V
mA
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, V CC = +3.0V to +3.6V, no input AC signals. T C = -40°C to +85°C, unless otherwise noted. Typical values
are at V CC = +3.3V, T C = +25°C, parameters are guaranteed by design and not production tested, unless otherwise noted.)
PARAMETER
Supply Voltage
Supply Current
SYMBOL
V CC
I CC
CONDITIONS
Total supply current, V CC = +3.3V
MIN
3.0
TYP
3.3
149.5
MAX
3.6
UNITS
V
mA
RECOMMENDED AC OPERATING CONDITIONS
PARAMETER
RF Frequency
LO Frequency
SYMBOL
f RF
f LO
(Note 7)
(Note 7)
CONDITIONS
MIN
2000
1800
TYP
MAX
3000
2550
UNITS
MHz
MHz
Using Mini-Circuits TC4-1W-17 4:1 transformer
as defined in the Typical Application Circuit , IF
matching components affect the IF frequency
100
500
IF Frequency
f IF
range (Note 7)
MHz
Using alternative Mini-Circuits TC4-1W-7A
4:1 transformer, IF matching components
affect the IF frequency range (Note 7)
50
250
LO Drive Level
P LO
-3
+3
dBm
2
_______________________________________________________________________________________
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相关代理商/技术参数 |
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| MAX19996ETP+ | 功能描述:上下转换器 High-Gain 2GHz to 3.9GHz Downconv RoHS:否 制造商:Texas Instruments 产品:Down Converters 射频:52 MHz to 78 MHz 中频:300 MHz LO频率: 功率增益: P1dB: 工作电源电压:1.8 V, 3.3 V 工作电源电流:120 mA 最大功率耗散:1 W 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PQFP-128 |
| MAX19996ETP+T | 功能描述:上下转换器 High-Gain 2GHz to 3.9GHz Downconv RoHS:否 制造商:Texas Instruments 产品:Down Converters 射频:52 MHz to 78 MHz 中频:300 MHz LO频率: 功率增益: P1dB: 工作电源电压:1.8 V, 3.3 V 工作电源电流:120 mA 最大功率耗散:1 W 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PQFP-128 |
| MAX19997 | 功能描述:上下转换器 RoHS:否 制造商:Texas Instruments 产品:Down Converters 射频:52 MHz to 78 MHz 中频:300 MHz LO频率: 功率增益: P1dB: 工作电源电压:1.8 V, 3.3 V 工作电源电流:120 mA 最大功率耗散:1 W 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PQFP-128 |
| MAX19997AETX+ | 功能描述:上下转换器 High-Gain 1.8GHz to 2.9GHz Downconv RoHS:否 制造商:Texas Instruments 产品:Down Converters 射频:52 MHz to 78 MHz 中频:300 MHz LO频率: 功率增益: P1dB: 工作电源电压:1.8 V, 3.3 V 工作电源电流:120 mA 最大功率耗散:1 W 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PQFP-128 |
| MAX19997AETX+T | 功能描述:上下转换器 High-Gain 1.8GHz to 2.9GHz Downconv RoHS:否 制造商:Texas Instruments 产品:Down Converters 射频:52 MHz to 78 MHz 中频:300 MHz LO频率: 功率增益: P1dB: 工作电源电压:1.8 V, 3.3 V 工作电源电流:120 mA 最大功率耗散:1 W 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PQFP-128 |
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