MAX19996ETP+ PDF资料下载(9/19 页)SiGe, High-Linearity, High-Gain, 2000MHz to 3000MHz Downconv

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参数资料

型号：	MAX19996ETP+
厂商：	MAXIM INTEGRATED PRODUCTS INC
元件分类：	通信及网络
英文描述：	SiGe, High-Linearity, High-Gain, 2000MHz to 3000MHz Downconversion Mixer with LO Buffer; Package: THIN QFN, 20 pin ; Temperature Range: -40°C to +85°C
中文描述：	SPECIALTY TELECOM CIRCUIT, QCC20
封装：	5 X 5 MM, ROHS COMPLIANT, TQFN-20
文件页数：	9/19页
文件大小：	398K
代理商：	MAX19996ETP+

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MAX19996

LEXT Inductor

Short LEXT to ground using a 0

Ω resistor. For applica-

tions requiring improved RF-to-IF and LO-to-IF isolation,

a 4.7nH low-ESR inductor can be connected from LEXT

to GND. However, the load impedance presented to the

mixer must be such that any capacitances from IF- and

IF+ to ground do not exceed several picofarads to

ensure stable operating conditions. Since approximate-

ly 120mA flows through LEXT, it is important to use a

low-DCR wire-wound inductor.

Layout Considerations

A properly designed PCB is an essential part of any

RF/microwave circuit. Keep RF signal lines as short as

possible to reduce losses, radiation, and inductance.

The load impedance presented to the mixer must be

such that any capacitance from both IF- and IF+ to

ground does not exceed several picofarads. For the best

performance, route the ground pin traces directly to the

exposed pad under the package. The PCB exposed pad

MUST be connected to the ground plane of the PCB. It is

suggested that multiple vias be used to connect this pad

to the lower-level ground planes. This method provides a

good RF/thermal-conduction path for the device. Solder

the exposed pad on the bottom of the device package to

the PCB. The MAX19996 evaluation kit can be used as a

reference for board layout. Gerber files are available

upon request at www.maxim-ic.com.

Power-Supply Bypassing

Proper voltage-supply bypassing is essential for high-

frequency circuit stability. Bypass each VCC pin with

the capacitors shown in the

Typical Application Circuit

and see Table 1.

Exposed Pad RF/Thermal Considerations

The exposed pad (EP) of the MAX19996’s 20-pin thin

QFN package provides a low thermal-resistance path

to the die. It is important that the PCB on which the

MAX19996 is mounted be designed to conduct heat

from the EP. In addition, provide the EP with a low-

inductance path to electrical ground. The EP MUST be

soldered to a ground plane on the PCB, either directly

or through an array of plated via holes.

DESIGNATION

QTY

DESCRIPTION

COMPONENT SUPPLIER

8.2pF microwave capacitor (0402)