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| 型号： | MAX1999EEI+T |
| 厂商： | Maxim Integrated |
| 文件页数： | 30/32页 |
| 文件大小： | 0K |
| 描述： | IC REG QD BCK/LINEAR SYNC 28QSOP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 拓扑： | 降压（降压）同步（2），线性（LDO）（2） |
| 功能： | 任何功能 |
| 输出数： | 4 |
| 频率 - 开关： | 200kHz ~ 500kHz |
| 电压/电流 - 输出 1： | 控制器 |
| 电压/电流 - 输出 2： | 控制器 |
| 电压/电流 - 输出 3： | 3.3V，100mA |
| 带 LED 驱动器： | 无 |
| 带监控器： | 无 |
| 带序列发生器： | 是 |
| 电源电压： | 4.5 V ~ 24 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-SSOP（0.154"，3.90mm 宽） |
| 供应商设备封装： | 28-QSOP |
| 包装： | 带卷 (TR) |
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High-Efficiency, Quad Output, Main Power-
Supply Controllers for Notebook Computers
USE AGND PLANE TO:
- BYPASS V CC AND REF
USE PGND PLANE TO:
- BYPASS LDO_
- TERMINATE EXTERNAL FB
- CONNECT PGND TO THE TOPSIDE STAR GROUND
VIA TO PGND
DIVIDER (IF USED)
- TERMINATE R ILIM
(IF USED)
- PIN-STRAP CONTROL
AGND
VIA BETWEEN POWER
AND ANALOG GROUND
VIA TO OUT5
OUT5
C3
GROUND
C4
OUT3
INPUTS
PGND
VIA TO OUT3
ANALOG GROUND
PLANE ON INNER LAYER
L1
N4
C1
C2
N2
L2
VIAS TO GROUND
VIA TO LX5
N3
V+
N1
VIA TO LX3
CONNECT PGND TO AGND
BENEATH THE CONTROLLER AT
ONE POINT ONLY AS SHOWN.
Figure 13. PC Board Layout Example
NOTE: EXAMPLE SHOWN IS FOR DUAL N-CHANNEL MOSFET.
PGND5). Avoid the introduction of AC currents into
the PGND3 and PGND5 ground planes. Run the
power plane ground currents on the top side only, if
possible.
? Use a star ground connection on the power plane to
minimize the crosstalk between OUT3 and OUT5.
? Keep the high-current paths short, especially at the
ground terminals. This practice is essential for sta-
ble, jitter-free operation.
? Keep the power traces and load connections short.
This practice is essential for high efficiency. Using
thick copper PC boards (2oz vs. 1oz) can enhance
full-load efficiency by 1% or more. Correctly routing
PC board traces must be approached in terms of
fractions of centimeters, where a single milliohm of
excess trace resistance causes a measurable effi-
ciency penalty.
? CS_ (MAX1777/MAX1977) / LX_ (MAX1999) and GND
connections to the synchronous rectifiers for current
limiting must be made using Kelvin sense connec-
tions to guarantee the current-limit accuracy. With 8-
pin SO MOSFETs, this is best done by routing power
to the MOSFETs from outside using the top copper
layer, while connecting CS_/LX_ traces inside (under-
neath) the MOSFETs.
? When trade-offs in trace lengths must be made, it is
preferable to allow the inductor charging path to be
made longer than the discharge path. For example,
is better to allow some extra distance between the
input capacitors and the high-side MOSFET than to
allow distance between the inductor and the syn-
chronous rectifier or between the inductor and the
output filter capacitor.
? Ensure that the OUT_ connection to C OUT_ is short and
direct. However, in some cases it may be desirable to
deliberately introduce some trace length between the
OUT_ connector node and the output filter capacitor
(see the Stability Considerations section).
? Route high-speed switching nodes (BST_, DH_, LX_,
and DL_) away from sensitive analog areas (REF,
ILIM_, and FB_). Use PGND3 and PGND5 as an EMI
shield to keep radiated switching noise away from the
IC’s feedback divider and analog bypass capacitors.
? Make all pin-strap control input connections ( SKIP ,
ILIM_, etc.) to GND or V CC of the device.
Layout Procedure
1) Place the power components first with ground ter-
minals adjacent (N2/N4 source, C IN_ , C OUT_ , D1
anode). If possible, make all these connections on
the top layer with wide, copper-filled areas.
2) Mount the controller IC adjacent to the synchronous
rectifier MOSFETs, preferably on the back side in
order to keep DH_, GND, and the DL_ gate drive
lines short and wide. The DL_ gate trace must be
short and wide measuring 50mils to 100mils wide if
the MOSFET is 1in from the controller device.
3) Group the gate-drive component (BST_ diode and
capacitor, V+ bypass capacitor) together near the
controller device.
30
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX1999EVKIT | 功能描述:DC/DC 开关控制器 Evaluation Kit for the MAX1777 MAX1977 MAX1999 RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
| MAX199ACAI | 功能描述:模数转换器 - ADC RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| MAX199ACAI+ | 功能描述:模数转换器 - ADC 12Bit 8Ch 100ksps 4.18V Precision ADC RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| MAX199ACAI+T | 功能描述:模数转换器 - ADC 12Bit 8Ch 100ksps 4.18V Precision ADC RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| MAX199ACAI-T | 功能描述:模数转换器 - ADC RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
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