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参数资料
| 型号： | MAX2027EUP+TD |
| 厂商： | Maxim Integrated |
| 文件页数： | 8/10页 |
| 文件大小： | 0K |
| 描述： | IC AMP VAR GAIN 20-TSSOP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 频率： | 50MHz ~ 400MHz |
| P1dB： | 20.6dBm（114.8mW） |
| 增益： | 15.5dB |
| 噪音数据： | 4.7dB |
| RF 型： | ATE，ISM，PHS，UMTS，WLL |
| 电源电压： | 4.75 V ~ 5.25 V |
| 电流 - 电源： | 60mA ~ 75mA |
| 测试频率： | 50MHz |
| 封装/外壳： | 20-TSSOP（0.173"，4.40mm 宽）裸露焊盘 |
| 包装： | 带卷 (TR) |
IF Digitally Controlled Variable-Gain Amplifier
V CC
1
20
RF IN
C 1
C 8 *
V CC
R 6
L 3 *
R 5
C 7
R 4
R 3
C 2
R 2
2
3
4
5
MAX2027
EXPOSED
PADDLE
19
18
17
16
ATTN OUT
L 4 *
C 3
C 9 *
L 1
B4
6
15
AMP IN
CONTROL
INPUTS
B3
B2
7
8
ATTENUATION
LOGIC
CONTROL
AMP
BIAS
14
13
I BIAS
I SET
R 1
C 10
B1
B0
9
10
12
11
L 2
C 4
RF OUT
V CC
*OPTIONAL COMPONENTS: USE TO IMPROVE HIGHER FREQUENCY MATCHING
Figure 1. Typical Application Circuit
C 5
C 6
Fixed-Gain Amplifier
The MAX2027 integrates a fixed-gain amplifier in a neg-
ative feedback topology. This fixed-gain amplifier is
optimized for a frequency range of operation from
50MHz to 400MHz with a high-output third-order inter-
cept point (OIP3). The bias current is chosen to opti-
mize the IP 3 of the amplifier. When R 1 is 825 ? , the
current consumption is 60mA while exhibiting a typical
35dBm output IP 3 .
Choke Inductor
The fixed-gain amplifier output port requires an external
pullup choke inductor to V CC . At the input, connect a
bias inductor of 330nH from AMP IN (pin 15) to I BIAS
(pin 14). At the output, connect a 680nH choke inductor
from RF_OUT (pin 12) to V CC (pin 11) to provide bias
current to the amplifier.
Layout Considerations
A properly designed PC board is an essential part of
any RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, radiation, and induc-
tance. For the best performance, route the ground pin
traces directly to the exposed pad under the package.
The PC board exposed pad must be connected to the
ground plane of the PC board. It is suggested that multi-
ple vias be used to connect this pad to the lower level
ground planes. This method provides a good RF/thermal
conduction path for the device. Solder the exposed pad
on the bottom of the device package to the PC board.
The MAX2027 Evaluation Kit can be used as a refer-
ence for board layout. Gerber files are available upon
request at www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each V CC pin with a
0.1μF and 100pF capacitor. Connect the 100pF capacitor
as close to V CC pins as possible.
Exposed Pad RF/Thermal Considerations
The exposed paddle (EP) of the MAX2027 ’s 20-pin
TSSOP-EP package provides a low thermal-resistance
path to the die. It is important that the PC board on
8
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