参数资料
型号: MAX2031_1
厂商: Maxim Integrated Products, Inc.
英文描述: Evaluation Kit
中文描述: 评估板
文件页数: 3/7页
文件大小: 238K
代理商: MAX2031_1
Testing the Mixer
Adjust the center and span of the spectrum analyzer to
observe the RF output tone at 810MHz for upconverter
operation. The level should be about -10dBm (7dB con-
version loss, 3dB pad loss). The spectrum analyzer
s
absolute magnitude accuracy is typically no better than
±1dB.
Disconnect the GND connection to LOSEL. It will be
pulled high by a pullup resistor on the board, selecting
LO2. Observe that the 809MHz signal increases while
the 810MHz decreases.
Reconfigure the test setup using a combiner or hybrid to
sum two of the frequency sources to do a two-tone IP3
measurement if desired. Terminate the unused LO input
in 50
.
Detailed Description
The MAX2031 is a high-linearity up/downconverter inte-
grated with RF and LO baluns, an LO buffer, and an
SPDT LO input select switch. The EV kit circuit uses the
MAX2031 and consists mostly of supply-decoupling
capacitors, DC-blocking capacitors, a current-setting
resistor, and an IF balun. The MAX2031 EV kit circuit
allows for thorough analysis and a simple design-in.
Supply-Decoupling Capacitors
C2, C7, C8, and C11 are 82pF supply-decoupling
capacitors used to filter high-frequency noise. C3, C6,
and C9 are larger 0.01μF capacitors used for filtering
lower frequency noise on the supply.
DC-Blocking Capacitors
The MAX2031 has internal baluns at the RF and LO
inputs. These inputs have almost 0
resistance at DC,
so DC-blocking capacitors C1, C10, and C12 are used
to prevent any external bias from being shunted directly
to ground.
LO Bias
The bias current for the integrated LO buffer is set with
resistor R1 (523
±1%). Increasing the value of R1 can
reduce the DC current of the device but the device
would operate at reduced performance levels (see the
Modifying the EV Kit
section).
TAP Network
The TAP pin for the internal balun is grounded.
IF±
The MAX2031 mixer has a DC to 250MHz IF frequency
range. Note that these differential ports are ideal for
providing enhanced IIP2 performance. Single-ended IF
applications require a 1:1 balun to transform the 50
differential IF impedance to 50
single-ended. After the
balun, the IF return loss is better than 15dB. The differ-
ential IF is used as an input port for upconverter opera-
tion. The user can use a differential IF amplifier follow-
ing the mixer but a DC block is required on both IF
pins.
Tuning Networks
The performance of the MAX2031 is enhanced with the
addition of external tuning networks. Capacitor C4 and
inductor L1 form a bandpass filter network that enhances
the linearity performance when the mixer is used to
upconvert an IF port signal to the RF port. This network is
constructed on the kit and limits the usable RF band-
width to approximately 750MHz to 850MHz (refer to the
MAX2031 data sheet). This network can be tuned to
accommodate other RF bands if desired.
Capacitor C5 is used to improve the linearity perfor-
mance of the MAX2031 when the mixer is used to
downconvert an RF port signal to the IF port. The value
of this cap could change slightly depending on the RF
and LO frequencies.
Capacitor C5 is not required for upconverter operation
and the C4/L1 network is not required for downconverter
operation.
LOSEL
The EV kit includes a 47k
pullup resistor (R2) for easy
selection of the LO port. Providing a ground at TP3
selects LO1, and leaving TP3 open selects LO2. To
drive TP3 from an external source, follow the limits
called out in the MAX2031 device data sheet. Logic
voltages should not be applied to LOSEL without the
+5V supply voltage. Doing so can cause the on-chip
ESD diodes to conduct and could damage the device.
Layout Considerations
The MAX2031 evaluation board can be a guide for board
layout. Pay close attention to thermal design and close
placement of components to the IC. The MAX2031 pack-
age exposed paddle (EP) conducts heat from the device
and provides a low-impedance electrical connection to
the ground plane. The EP must be attached to the PC
board ground plane with a low thermal and electrical
impedance contact. Ideally, this is achieved by soldering
the backside of the package directly to a top metal
ground plane on the PC board. Alternatively, the EP can
be connected to an internal or bottom-side ground plane
using an array of plated vias directly below the EP. The
MAX2031 EV kit uses nine evenly spaced, 0.016in-diam-
eter, plated through holes to connect the EP to the lower
ground planes.
Depending on the ground plane spacing, large sur-
face-mount pads in the IF path may need to have the
E
MAX2031 Evaluation Kit
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MAX2031ETP+ 功能描述:射频混合器 .815GHz-1GHz Up/Down Mixer RoHS:否 制造商:NXP Semiconductors 频率范围: 转换损失——最大: 工作电源电压:6 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube
MAX2031ETP+T 功能描述:射频混合器 .815GHz-1GHz Up/Down Mixer RoHS:否 制造商:NXP Semiconductors 频率范围: 转换损失——最大: 工作电源电压:6 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube
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