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| 型号： | MAX2039ETP+ |
| 厂商： | Maxim Integrated |
| 文件页数： | 13/16页 |
| 文件大小： | 0K |
| 描述： | IC MIXER UP/DWN HI LIN 20-TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 60 |
| 系列： | MAX2039 |
| RF 型： | 手机，CDMA2000，EDGE，GSM，W-CDMA |
| 频率： | 1.7GHz ~ 2.2GHz |
| 混频器数目： | 1 |
| 噪音数据： | 7.3dB |
| 次要属性： | 升/降频器 |
| 电流 - 电源： | 135mA |
| 电源电压： | 4.75 V ~ 5.25 V |
| 包装： | 管件 |
| 封装/外壳： | 20-WQFN 裸露焊盘 |
| 供应商设备封装： | 20-TQFN-EP（5x5） |
High-Linearity, 1700MHz to 2200MHz Upconversion/
Downconversion Mixer with LO Buffer/Switch
If frequency hopping is not employed, set the switch to
either of the LO inputs. The switch is controlled by a
digital input (LOSEL): logic high selects LO2, logic low
Table 1. Component List Referring to the
Typical Application Circuit
selects LO1. In order to avoid damage to the part, volt-
age MUST be applied to V CC before digital logic is
applied to LOSEL (see the Absolute Maximum Ratings ).
LO1 and LO2 inputs are internally matched to 50 Ω ,
requiring only a 22pF DC-blocking capacitor.
A two-stage internal LO buffer allows a wide-input
power range for the LO drive. All guaranteed specifica-
tions are for an LO signal power from -3dBm to +3dBm.
The on-chip low-loss balun, along with an LO buffer,
drives the double-balanced mixer. All interfacing and
matching components from the LO inputs to the IF out-
COMPONENT
C1
C4
C2, C6, C7, C8,
C10, C12
C3, C5, C9, C11
R1
T1
VALUE
4pF
10pF
22pF
0.01μF
549 Ω
1:1 Balun
DESCRIPTION
Microwave capacitor (0603)
Microwave capacitor (0603)
Microwave capacitors (0603)
Microwave capacitors (0603)
±1% resistor (0603)
IF balun with DC grounded
ports
puts are integrated on chip.
U1
MAX2039 Maxim IC
High-Linearity Mixer
The core of the MAX2039 is a double-balanced, high-
performance passive mixer. Exceptional linearity is pro-
vided by the large LO swing from the on-chip LO
buffer.
Differential IF
The MAX2039 mixer has an IF frequency range of DC to
350MHz. Note that these differential ports are ideal for
providing enhanced IIP2 performance. Single-ended IF
applications require a 1:1 balun to transform the 50 Ω dif-
ferential IF impedance to a 50 Ω single-ended system.
After the balun, the IF return loss is better than 15dB.
The differential IF is used as an input port for upconvert-
er operation. The user can use a differential IF amplifier
following the mixer but a DC block is required on both IF
pins. In this configuration, the IF+ and IF- pins need to
be returned to ground through a high resistance (about
1k Ω ). This ground return can also be accomplished by
grounding the RF TAP (pin 3) and AC-coupling the IF+
and IF- ports (pins 19 and 18).
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50 Ω . No
matching components are required. Return loss at the RF
port is typically 18dB over the entire input range
(1700MHz to 2200MHz) and return loss at the LO ports is
typically 16dB (1500MHz to 2000MHz). RF and LO inputs
require only DC-blocking capacitors for interfacing.
The IF output impedance is 50 Ω (differential). For eval-
uation, an external low-loss 1:1 (impedance ratio) balun
transforms this impedance to a 50 Ω single-ended out-
put (see the Typical Application Circuit ).
Bias Resistor
Bias current for the LO buffer is optimized by fine tun-
ing resistor R1. If reduced current is required at the
expense of performance, contact the factory for details.
If the ±1% bias resistor values are not readily available,
substitute standard ±5% values.
Layout Considerations
A properly designed PC board is an essential part of
any RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, radiation, and induc-
tance. For the best performance, route the ground pin
traces directly to the exposed pad under the package.
The PC board exposed pad MUST be connected to the
ground plane of the PC board. It is suggested that mul-
tiple vias be used to connect this pad to the lower-level
ground planes. This method provides a good RF/ther-
mal conduction path for the device. Solder the exposed
pad on the bottom of the device package to the PC
board. The MAX2039 Evaluation Kit can be used as a
reference for board layout. Gerber files are available
upon request at www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each V CC pin and
TAP with the capacitors shown in the Typical
Application Circuit; see Table 1. Place the TAP bypass
capacitor to ground within 100 mils of the TAP pin.
______________________________________________________________________________________
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX2039ETP+ | 功能描述:上下转换器 1.7GHz-2.2GHz Up/Down Mixer RoHS:否 制造商:Texas Instruments 产品:Down Converters 射频:52 MHz to 78 MHz 中频:300 MHz LO频率: 功率增益: P1dB: 工作电源电压:1.8 V, 3.3 V 工作电源电流:120 mA 最大功率耗散:1 W 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PQFP-128 |
| MAX2039ETP+D | 功能描述:射频混合器 1.7GHz-2.2GHz Up/Down Mixer RoHS:否 制造商:NXP Semiconductors 频率范围: 转换损失——最大: 工作电源电压:6 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| MAX2039ETP+T | 功能描述:射频混合器 1.7GHz-2.2GHz Up/Down Mixer RoHS:否 制造商:NXP Semiconductors 频率范围: 转换损失——最大: 工作电源电压:6 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| MAX2039ETP+TD | 功能描述:射频混合器 1.7GHz-2.2GHz Up/Down Mixer RoHS:否 制造商:NXP Semiconductors 频率范围: 转换损失——最大: 工作电源电压:6 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| MAX2039ETPD | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:High-Linearity, 1700MHz to 2200MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch |
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