参数资料
型号: MAX2042AETP+
厂商: MAXIM INTEGRATED PRODUCTS INC
元件分类: 无绳电话/电话
英文描述: TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC20
封装: 5 X 5 MM, ROHS COMPLIANT, TQFN-20
文件页数: 34/52页
文件大小: 9827K
代理商: MAX2042AETP+
Maxim Integrated Products 4
MAX2042A
SiGe High-Linearity, 1600MHz to 3900MHz
Upconversion/Downconversion Mixer with LO Buffer
VCC to GND..........................................................-0.3V to +5.5V
IF+, IF-, LOBIAS to GND ......................... -0.3V to (VCC + 0.3V)
RF, LO Input Power....................................................... +20dBm
IF Input Power (50ω source)......................................... +18dBm
RF, LO Current (RF and LO are DC shorted to
GND through a balun)....................................................50mA
Operating Case Temperature Range (Note 1)....... -40NC to +85NC
Continuous Power Dissipation (Note 2) ..............................5.0W
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering 10s) .................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ABSOLUTE MAXIMUM RATINGS
Note 1: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.
Note 2: Based on junction temperature TJ = TC + (BJC x VCC x ICC). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150NC.
Note 3: Junction temperature TJ = TA + (BJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150NC.
Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
TQFN
Junction-to-Ambient
Thermal Resistance BJA (Notes 3, 4) ....................... +38°C/W
Junction-to-Case
Thermal Resistance BJC (Notes 2, 4)....................... +13°C/W
PACKAGE THERMAL CHARACTERISTICS
5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, VCC = 4.75V to 5.25V, no input AC signals. TC = -40NC to +85NC, unless otherwise noted. Typical values
are at VCC = 5.0V, TC = +25NC.)
3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, VCC = 3.0V to 3.6V, no input AC applied. TC = -40NC to +85NC, unless otherwise noted. Typical values
are at VCC = 3.3V, TC = +25NC.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
VCC
4.75
5
5.25
V
Supply Current
ICC
140
162
mA
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
VCC
3.0
3.3
3.6
V
Supply Current
ICC
122
mA
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