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| 型号： | MAX2042ETP+ |
| 厂商： | Maxim Integrated |
| 文件页数： | 2/27页 |
| 文件大小： | 0K |
| 描述： | IC MIXER UP/DOWN CONV 20-TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 50 |
| RF 型： | WiMax |
| 频率： | 2GHz ~ 3.0GHz |
| 混频器数目： | 1 |
| 噪音数据： | 7.3dB |
| 次要属性： | 升/降频器 |
| 电流 - 电源： | 138mA |
| 电源电压： | 3.3V，5V |
| 包装： | 托盘 |
| 封装/外壳： | 20-WQFN 裸露焊盘 |
| 供应商设备封装： | 20-TQFN-EP（5x5） |
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SiGe High-Linearity, 2000MHz to 3000MHz
Upconversion/Downconversion Mixer with LO Buffer
ABSOLUTE MAXIMUM RATINGS
V CC to GND..........................................................-0.3V to +5.5V
IF+, IF-, LOBIAS to GND .......................... -0.3V to (V CC + 0.3V)
RF, LO Input Power ....................................................... +20dBm
RF, LO Current (RF and LO are DC shorted
to GND through a balun)................................... .............50mA
Continuous Power Dissipation (Note 1) .............................5.0W
B JC (Notes 1, 3) ............................................................ +13 N C/W
Operating Case Temperature Range
(Note 4)........................................................... -40 N C to +85 N C
Junction Temperature .....................................................+150 N C
Storage Temperature Range............................ -65 N C to +150 N C
Lead Temperature (soldering, 10s) ................................+300 N C
B JA (Notes 2, 3) ............................................................ +38 N C/W
Note 1: Based on junction temperature T J = T C + ( B JC x V CC x I CC ). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150 N C.
Note 2: Junction temperature T J = T A + ( B JA x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150 N C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Note 4: T C is the temperature on the exposed pad of the package. T A is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
+5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit , V CC = +4.75V to +5.25V, no input AC signals. T C = -40 N C to +85 N C, unless otherwise noted. Typical
values are at V CC = +5.0V, T C = +25 N C, all parameters are production tested.)
PARAMETER
Supply Voltage
Supply Current
SYMBOL
V CC
I CC
CONDITIONS
MIN
4.75
TYP
5.0
138
MAX
5.25
150
UNITS
V
mA
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit , V CC = +3.0V to +3.6V, no input AC signals. T C = -40 N C to +85 N C, unless otherwise noted. Typical values
are at V CC = +3.3V, T C = +25 N C, all parameters are production tested.)
PARAMETER
Supply Voltage
Supply Current
SYMBOL
V CC
I CC
CONDITIONS
MIN
3.0
TYP
3.3
120
MAX
3.6
135
UNITS
V
mA
RECOMMENDED AC OPERATING CONDITIONS
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Typical Application Circuit with
RF Frequency Range
C1 = 8.2pF, see Table 1 for details
2000
3000
MHz
(Notes 5, 6)
LO Frequency
f LO
(Notes 5, 6)
1800
2800
MHz
Using M/A-Com MABAES0029 1:1
IF Frequency
f IF
transformer as defined in the Typical
Application Circuit , IF matching components
50
500
MHz
affect the IF frequency range (Notes 5, 6)
LO Drive
P LO
(Notes 5, 6)
-3
0
+3
dBm
2
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