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参数资料
| 型号： | MAX2055EUP+TD |
| 厂商： | Maxim Integrated |
| 文件页数： | 12/13页 |
| 文件大小： | 0K |
| 描述： | IC ADC DRVR/AMP VAR GAIN 20TSSOP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 功能： | ADC 驱动器/放大器 |
| 频率： | 30MHz ~ 300MHz |
| RF 型： | 手机，ATE，PHS/PAS |
| 次要属性： | 40dBm 输出 IP3 |
| 封装/外壳： | 20-TSSOP（0.173"，4.40mm 宽）裸露焊盘 |
| 包装： | 带卷 (TR) |
Digitally Controlled, Variable-Gain, Differential
ADC Driver/Amplifier
package. This pad should be connected to the ground
plane of the board by using multiple vias under the
device to provide the best RF/thermal conduction path.
Table 3. Attenuation Setting vs. Gain-
Control Bits
Solder the exposed pad on the bottom of the device
package to a PC board exposed pad.
The MAX2055 Evaluation Kit can be used as a refer-
ence for board layout. Gerber files are available upon
request at www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each V CC pin with a
1000pF and 100pF capacitor. Connect the 100pF
capacitor as close to the device as possible. Resistor
R7 helps reduce switching transients. If switching tran-
sients are not a concern, R7 is not required. Therefore,
connect pin 9 directly to V CC .
Exposed Paddle RF Thermal
Considerations
The EP of the MAX2055’s 20-pin TSSOP-EP package
provides a low thermal-resistance path to the die. It is
important that the PC board on which the IC is mounted
be designed to conduct heat from this contact. In addi-
tion, the EP provides a low-inductance RF ground path
for the device.
It is recommended that the EP be soldered to a ground
plane on the PC board, either directly or through an
array of plated via holes.
Soldering the pad to ground is also critical for efficient
heat transfer. Use a solid ground plane wherever
possible.
ATTENUATION
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
B4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
B3*
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
X
X
X
X
X
X
X
X
B2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
B1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
B0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
TRANSISTOR COUNT: 325
PROCESS: BiCMOS
Chip Information
*Enabling B4 disables B3 and the minimum attenuation is
16dB.
12
______________________________________________________________________________________
相关PDF资料 |
PDF描述 |
|---|---|
| MAX2055EVKIT | EVAL KIT FOR MAX2055 |
| MAX2056EVKIT | EVAL KIT FOR MAX2056 |
| MAX2057EVKIT | EVAL KIT FOR MAX2057 |
| MAX2058EVKIT | EVAL KIT FOR MAX2058 |
| MAX2059ETL+ | IC DVGA SPI HI LIN 40-TQFN |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX2055EVKIT | 功能描述:射频放大器 RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| MAX2056 | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:Evaluation Kit |
| MAX2056_1 | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:Evaluation Kit |
| MAX2056ETX | 功能描述:射频放大器 0.8GHz - 1GHz Variable-Gain Amp RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| MAX2056ETX+ | 功能描述:射频放大器 0.8GHz - 1GHz Variable-Gain Amp RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
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