参数资料
型号: MAX2057ETX+
厂商: Maxim Integrated
文件页数: 9/13页
文件大小: 0K
描述: IC AMP VARIABLE GAIN 36-TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 50
频率: 1.7GHz ~ 2.5GHz
P1dB: 23.8dBm(239.9mW)
增益: 13.5dB ~ 17.5dB
噪音数据: 6dB
RF 型: 手机,ATE,GSM,EDGE,ISM,W-CDMA,802.16/WiMax,CDMA2000
电源电压: 4.75 V ~ 5.25 V
电流 - 电源: 180mA ~ 230mA
测试频率: 2.1GHz
封装/外壳: 36-WFQFN 裸露焊盘
包装: 管件
1300MHz to 2700MHz Variable-Gain
Amplifier with Analog Gain Control
Pin Description
PIN
1, 3, 4, 6, 7,
9, 10, 12,
14, 18, 19,
21 –24, 27,
28, 30, 31,
33, 34, 36
2
5, 13, 16,
25, 32
NAME
GND
OUT_A
V CC
FUNCTION
Ground. Connect to the board’s ground plane using low-inductance layout techniques.
Second-Attenuator Output. Internally matched to 50
over the operating frequency band. Connect
to IN through a DC-blocking capacitor if greater than 21dB of gain-control range is required. No
connection is required if the second attenuator is not used.
Power Supply. Bypass each pin to GND with capacitors as shown in the Typical Application
Circuit. Place capacitors as close to the pin as possible.
Second-Attenuator Input. Internally matched to 50
over the operating frequency band. Connect to
8
IN_A
a 50
RF source through a DC-blocking capacitor if greater than 21dB of gain-control range is
required. No connection is required if the second attenuator is not used.
11
V CNTL
Analog Gain-Control Input. Limit voltages applied to this pin to a 1V to 4.5V range when V CC is
present to ensure device reliability.
15
17
R SET1
R SET2
First-Stage Amplifier Bias-Current Setting. Connect to GND through a 1.2k
Second-Stage Amplifier Bias-Current Setting. Connect to GND through a 2k
resistor.
resistor.
20
26
OUT
AMP_IN
RF Output. Internally matched to 50 over the operating frequency band. Requires a DC-blocking
capacitor and a shunt-matching capacitor.
Amplifier Input. Internally matched to 50 over the operating frequency band. Connect to
ATTN_OUT through a DC-blocking capacitor.
29
ATTN_OUT
Attenuator Output. Internally matched to 50
AMP_IN through a DC-blocking capacitor.
over the operating frequency band. Connect to
35
IN
RF Input. Internally matched to 50 over the operating frequency band. Connect to a 50
source through a DC-blocking capacitor if the second attenuator is not used.
RF
EP
Exposed Pad. This pad affects RF performance and provides heat dissipation. This pad MUST be
soldered evenly to the board ’s ground plane for proper operation.
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9
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