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| 型号： | MAX2064ETM+T |
| 厂商： | Maxim Integrated |
| 文件页数： | 2/20页 |
| 文件大小： | 0K |
| 描述： | IC VGA PROG ANALOG 48TQFN-EP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 频率： | 50MHz ~ 1GHz |
| P1dB： | 18.7dBm |
| 增益： | 20.6dB |
| 噪音数据： | 5.7dB |
| RF 型： | 通用 |
| 电源电压： | 3.135 V ~ 3.465 V，4.75 V ~ 5.25 V |
| 电流 - 电源： | 143mA |
| 测试频率： | 900MHz |
| 封装/外壳： | 48-WFQFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
Dual 50MHz to 1000MHz High-Linearity,
Serial/Analog-Controlled VGA
ABSOLUTE MAXIMUM RATINGS
V CC_AMP_1 , V CC_AMP_2 , V CC_RG to GND ..........-0.3V to +5.5V
PD_1, PD_2, AMPSET to GND .............................-0.3V to +3.6V
A_VCTL_1, A_VCTL_2 to GND .............................-0.3V to +3.6V
DAT, CS , CLK, AA_SP to GND ............................-0.3V to +3.6V
AMP_IN_1, AMP_IN_2 to GND ..........................+0.95V to +1.2V
AMP_OUT_1, AMP_OUT_2 to GND .....................-0.3V to +5.5V
A_ATT_IN_1, A_ATT_IN_2, A_ATT_OUT_1,
A_ATT_OUT_2 to GND ......................................... 0V to +3.6V
REG_OUT to GND ................................................-0.3V to +3.6V
RF Input Power (A_ATT_IN_1, A_ATT_IN_2)................. +20dBm
RF Input Power (AMP_IN_1, AMP_IN_2)....................... +18dBm
q JC (Notes 1, 2) ......................................................... +12.3 N C/W
q JA (Notes 2, 3) ............................................................ +38 N C/W
Continuous Power Dissipation (Note 1) ..............................5.3W
Operating Case Temperature Range (Note 4) .. -40 N C to +85 N C
Junction Temperature .....................................................+150 N C
Storage Temperature Range............................ -65 N C to +150 N C
Lead Temperature (soldering, 10s) ................................+300 N C
Soldering Temperature (reflow) ......................................+260 N C
Note 1: Based on junction temperature T J = T C + ( q JC x V CC x I CC ). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150 N C.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Note 3: Junction temperature T J = T A + ( q JA x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150 N C.
Note 4: T C is the temperature on the exposed pad of the package. T A is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
+5V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V CC = V CC_AMP_1 = V CC_AMP_2 = V CC_RG = +4.75V to +5.25V, AMPSET = 0, PD_1 = PD_2 = 0,
T C = -40 N C to +85 N C. Typical values are at V CC_ = +5.0V and T C = +25 N C, unless otherwise noted.)
PARAMETER
Supply Voltage
Supply Current
Power-Down Current
SYMBOL
V CC
I DC
I DCPD
CONDITIONS
PD_1 = PD_2 = 1, V IH = 3.3V
MIN
4.75
TYP
5
143
5.3
MAX
5.25
210
8
UNITS
V
mA
mA
Input Low Voltage
V IL
0.5
V
Input High Voltage
Input Logic Current
V IH
I IH, I IL
1.7
-1
3.465
+1
V
F A
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V CC = V CC_AMP_1 = V CC_AMP_2 = V CC_RG = +3.135V to +3.465V, AMPSET = 1, PD_1 = PD_2 = 0,
T C = -40 N C to +85 N C. Typical values are at V CC_ = +3.3V and T C = +25 N C, unless otherwise noted.)
PARAMETER
Supply Voltage
Supply Current
Power-Down Current
SYMBOL
V CC
I DC
I DCPD
CONDITIONS
PD_1 = PD_2 = 1, V IH = 3.3V
MIN
3.135
TYP
3.3
84.7
4.5
MAX
3.465
145
8
UNITS
V
mA
mA
Input Low Voltage
Input High Voltage
V IL
V IH
0.5
1.7
V
V
2
______________________________________________________________________________________
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相关代理商/技术参数 |
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| MAX2064EVKIT# | 功能描述:放大器 IC 开发工具 MAX2064 Eval Kit RoHS:否 制造商:International Rectifier 产品:Demonstration Boards 类型:Power Amplifiers 工具用于评估:IR4302 工作电源电压:13 V to 23 V |
| MAX2065 | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:50MHz to 1000MHz High-Linearity, Serial/ Parallel-Controlled Analog/Digital VGA |
| MAX2065ETL+ | 功能描述:射频放大器 Dl 50-1000MHz Hi-Lin Analog/Digital VGA RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| MAX2065ETL+T | 功能描述:射频放大器 Dl 50-1000MHz Hi-Lin Analog/Digital VGA RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| MAX2065EVKIT | 功能描述:射频放大器 RF and RFID RF Evaluation & Development Kits & Boards - KIT EVALUATION FOR MAX2065 RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
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