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| 型号： | MAX2077CTK+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 12/20页 |
| 文件大小： | 0K |
| 描述： | IC FRONT-END ULTRASOUND 68TQFN |
| 应用说明： | Ultrasound Imaging Systems Application Note |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 30 |
| 类型： | 超声波接收器 |
| 应用： | 医疗用超声波成像，声纳 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 68-TQFN 裸露焊盘 |
| 供应商设备封装： | 68-TQFN-EP（10x10） |
| 包装： | 管件 |
MAX2077
Octal-Channel Ultrasound Front-End
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(
Typical Application Circuits, VREF = 2.475V to 2.525V, VCC1 = 3.13V to 3.47V, VCC2 = 4.5V to 5.25V, TA = 0°C to +70°C, VGND = 0V,
NP = 0, PD = 0, no RF signals applied. Typical values are at VCC1 = 3.3V, VCC2 = 4.75V, TA = +25°C, unless otherwise noted.) (Note 5)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.
Note 2: Junction temperature TJ = TC + (
θJC x VCC x ICC). This formula can only be used if the component is soldered down to a print-
ed circuit board pad containing multiple ground vias to remove the heat. The junction temperature must not exceed 150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Note 4: Junction temperature TJ = TA + (
θJA x VCC x ICC), assuming there is no heat removal from the exposed pad. The junction
temperature must not exceed 150°C.
VCC_ to GND .........................................................-0.3V to +5.5V
VCC2 - VCC1......................................................................> -0.3V
ZF_, IN_, AG to GND ................................-0.3V to (VCC_ + 0.3V)
INC_ ..............................................................................20mA DC
VREF to GND.............................................................-0.3V to +3V
IN_ to AG ...............................................................-0.6V to +0.6V
OUT_, DIN, DOUT, VG_, NP, CS, CLK,
PD to GND ..........................................-0.3V to (VCC1 + 0.3V)
VCC_, VREF analog and digital control signals must be applied
in this order
Input Differential Voltage ................................2.0VP-P differential
Continuous Power Dissipation (TA = +70°C)
56-Pin TQFN (derate 47.6mW/°C above +70°C) ..............3.8W
68-Pin TQFN (derate 40.0mW/°C above +70°C) ..............4.0W
Operating Temperature Range (Note 1).................0°C to +70°C
Junction Temperature ......................................................+150°C
θJC (Notes 2, 3) (56-Pin TQFN)..........................................1°C/W
θJC (Notes 2, 3) (68-Pin TQFN).......................................0.3°C/W
θJA (Notes 3, 4) (56-Pin TQFN) ........................................21°C/W
θJA (Notes 3, 4) (68-Pin TQFN) ........................................20°C/W
Storage Temperature Range .............................-40°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
3.3V Supply Voltage
VCC1
3.13
3.3
3.47
V
4.75V/5V Supply Voltage
VCC2
4.5
4.75
5.25
V
External Reference Voltage
Range
VREF
(Note 6)
2.475
2.525
V
CMOS Input High Voltage
VIH
Applies to CMOS control inputs
2.5
V
CMOS Input Low Voltage
VIL
Applies to CMOS control inputs
0.8
V
CMOS Input Leakage Current
IIN
0V to 3.3V
10
μA
Data Output High Voltage
DOUT_HI
10M
load
VCC1
V
Data Output Low Voltage
DOUT_LO
10M
load
0
V
4.75V/5V Supply Standby Current
I_NP_5V_TOT
NP = 1, all channels
3.9
6
mA
3V Supply Standby Current
I_NP_3V_TOT
NP = 1, all channels
1.7
3
mA
4.75V/5V Power-Down Current
I_PD_5V_TOT
PD = 1, all channels (Note 7)
0.4
10
μA
3V Power-Down Current
I_PD_3V_TOT
PD = 1, all channels (Note 7)
0.3
10
μA
3V Supply Current per Channel
I_3V_NM
Total I divided by 8, VG+ - VG- = -2V
11
18
mA
4.75V/5V Supply Current per
Channel
I_5V_NM
Total I divided by 8
6.0
8.3
mA
DC Power per Channel
P_NM
64.8
105
mW
Differential Analog Control
Voltage Range
VGAIN_RANG
VG+ - VG-
±3
V
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX2077CTK+ | 功能描述:射频前端 8Ch Ultrasound Front-End RoHS:否 制造商:Skyworks Solutions, Inc. 类型: 工作频率:2.4 GHz, 5 GHz 最大数据速率:54 Mbps 噪声系数: 工作电源电压:3.3 V 电源电流:180 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-32 |
| MAX2077CTK+T | 功能描述:射频前端 8Ch Ultrasound Front-End RoHS:否 制造商:Skyworks Solutions, Inc. 类型: 工作频率:2.4 GHz, 5 GHz 最大数据速率:54 Mbps 噪声系数: 工作电源电压:3.3 V 电源电流:180 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-32 |
| MAX2077CTN+ | 功能描述:射频前端 8Ch Ultrasound Front-End RoHS:否 制造商:Skyworks Solutions, Inc. 类型: 工作频率:2.4 GHz, 5 GHz 最大数据速率:54 Mbps 噪声系数: 工作电源电压:3.3 V 电源电流:180 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-32 |
| MAX2077CTN+T | 功能描述:射频前端 8Ch Ultrasound Front-End RoHS:否 制造商:Skyworks Solutions, Inc. 类型: 工作频率:2.4 GHz, 5 GHz 最大数据速率:54 Mbps 噪声系数: 工作电源电压:3.3 V 电源电流:180 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-32 |
| MAX2077EVKIT# | 功能描述:射频前端 Octal-Channel Ultrasound Front-End RoHS:否 制造商:Skyworks Solutions, Inc. 类型: 工作频率:2.4 GHz, 5 GHz 最大数据速率:54 Mbps 噪声系数: 工作电源电压:3.3 V 电源电流:180 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-32 |
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