参数资料
型号: MAX2092ETP+
厂商: Maxim Integrated
文件页数: 2/15页
文件大小: 0K
描述: IC UPCONVERTING MIXER 20TQFN
标准包装: 60
RF 型: 通用
频率: 50MHz ~ 500MHz
混频器数目: 1
增益: 23dB
噪音数据: 5.4dB
次要属性: 升频器
电流 - 电源: 264mA
电源电压: 5.5V
包装: 管件
封装/外壳: 20-WQFN 裸露焊盘
供应商设备封装: 20-TQFN-EP(5x5)
MAX2092
700MHz to 2700MHz Analog VGA with Threshold
Alarm Circuit and Error Amplifier for Level Control
ABSOLUTE MAXIMUM RATINGS
V CC_RF , V CC_A ........................................................-0.3V to +6V
RF_OUT, RF_IN ........................................ -0.3V to (V CC + 0.3V)
R_BIAS, CTRL1, CTRL2,
PLVLSET, DET_VIN ... -0.3V to Minimum (V CC + 0.3V, +3.6V)
RF_IN Input Power ........................................................ +15dBm
RF_OUT Output Power .................................................. +23dBm
Operating Case Temperature
Range (Note 2) ............................................... -40 N C to +95 N C
Maximum Junction Temperature.....................................+150 N C
Storage Temperature Range............................ -65 N C to +150 N C
Lead Temperature (soldering, 10s) ................................+300 N C
Soldering Temperature (reflow) .................................... +260 N C
Continuous Power Dissipation (Note 1) .............................2.5W
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note 1: Based on junction temperature T J = T C + ( B JC x V CC x I CC ). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150 N C.
Note 2: T C is the temperature on the exposed pad of the package. T A is the ambient temperature of the device and PCB.
PACKAGE THERMAL CHARACTERISTICS
Junction-to-Ambient Thermal Resistance ( q JA )
(Notes 3, 4) ................................................................. 32°C/W
Junction-to-Case Thermal Resistance ( q JC )
(Notes 1, 4) ................................................................... 7°C/W
Note 3: Junction temperature T J = T A + ( q JA x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150 N C.
Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit with V CC = 4.75V to 5.8V, V GND = 0V, and T C = -40°C to +95°C. Typical values are at V CC = 5.5V and
T C = +25°C, unless otherwise noted.) (Note 5)
PARAMETER
Supply Voltage
SYMBOL
V CC
CONDITIONS
MIN
4.75
TYP
MAX
5.8
UNITS
V
Power down: CTRL1 = 0, CTRL2 = 0
2
3
Total Supply Current
I DC
VGA-only mode: CTRL1 = 1, CTRL2 = 0
80
90
mA
ALC mode: CTRL1 = 1, CTRL2 = 1
93
110
CTRL1/CTRL2 Logic-Low Input
Voltage
CTRL1, CTRL2 Logic-High Input
Voltage
V IL
V IH
2.2
0.8
V
V
Input Logic Current
PLVLSET Input-Voltage Range
DET_VIN Input-Voltage Range
I IH, I IL
V IN
V IN
-1
0
0
+1
2.5
2.5
μA
V
V
2
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