参数资料
型号: MAX2240EBL+T
厂商: Maxim Integrated
文件页数: 1/10页
文件大小: 0K
描述: IC PWR AMP 2.4-2.5GHZ 9UCSP
标准包装: 2,500
频率: 2.4GHz ~ 2.5GHz
RF 型: 通用
电源电压: 2.7 V ~ 5 V
电流 - 电源: 105mA
封装/外壳: 9-UFBGA,WLCSP
包装: 带卷 (TR)
19-1624; Rev 3; 8/11
ATION
EVALU
AVAILA
KIT
BLE
2.5GHz, +20dBm Power Amplifier IC
in UCSP Package
General Description
The MAX2240 single-supply, low-voltage power amplifi-
er (PA) IC is designed specifically for applications in
the 2.4GHz to 2.5GHz frequency band. The PA is com-
pliant with Bluetooth, HomeRF, and 802.11 standards,
as well as other FSK modulation systems. The PA pro-
vides a nominal +20dBm (100mW) output power in the
highest power mode.
The PA includes a digital power control circuit to greatly
simplify control of the output power. Four digitally con-
trolled output power levels are provided: from +3dBm
to +20dBm. A digital input controls the active or shut-
down operating modes of the PA. In the shutdown
mode, the current reduces to 0.5μA.
The IC integrates the RF input and interstage matching
to simplify application of the IC. Temperature and sup-
ply-independent biasing are also included to provide
stable performance under all operating conditions.
The IC operates from a +2.7V to +5V single-supply volt-
age. No negative bias voltage is required. Current con-
Features
o 2.4GHz to 2.5GHz Frequency Range
o High +20dBm Output Power
o 2-Bit Digital Power Control: Four Output Levels
o Integrated Input Match to 50Ω
o Low 105mA Operating Current
o 0.5μA Low-Power Shutdown Mode Current
o +2.7V to +5V Single-Supply Operation
o Miniature Chip-Scale Package (1.56mm x 1.56mm)
Ordering Information
sumption is a modest 105mA at the highest power
level.
PART
MAX2240EBL+
TEMP RANGE
-40°C to +85°C
PIN-PACKAGE
9 UCSP*
The part is packaged in the UCSP? package signifi-
cantly reducing the required PC board area. The chip
occupies only a 1.56mm x 1.56mm area. The 3 x 3
array of solder bumps are spaced with a 0.5mm bump
pitch.
________________________Applications
Bluetooth
HomeRF
802.11 FHSS WLAN
*UCSP reliability is integrally linked to the user’s assembly
methods, circuit board material, and environment. Refer to the
UCSP Reliability Notice in the UCSP section of this data sheet
for more information.
+Denotes a lead(pB)-free/RoHS-compliant package.
Bump Configuration appears at end of data sheet.
UCSP is a trademark of Maxim Integrated Products, Inc.
2.4GHz ISM Proprietary Radios
Typical Application Circuit/Functional Diagram
V CC
V CC
18pF
V CC
220 pF
1.2nH* (BOARD TRACE)
D0
BIAS
V CC
22nH
D1
BIAS &
POWER
SHDN
RFIN
CONTROL
MATCH
RFOUT
75 Ω
θ = 26 °
10pF
RFOUT
*INDUCTANCE CREATED WITH PC BOARD TRANSMISSION LINE
(SEE APPLICATIONS SECTION).
GND1
GND2
65 Ω
θ = 41 °
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1
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