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参数资料
| 型号： | MAX2244 |
| 厂商： | Maxim Integrated Products, Inc. |
| 英文描述： | 2.5GHz, 22dBm/20dBm Power Amplifiers with Analog Closed-Loop Power Control |
| 中文描述： | 2.5GHz、22dBm/20dBm功率放大器，带有模拟闭环功率控制 |
| 文件页数： | 13/14页 |
| 文件大小： | 312K |
| 代理商： | MAX2244 |
Layout
A good layout is necessary to achieve high-output power
with good efficiency. A solid ground plane must be used,
with any free board space also being grounded.
Connect any ground planes using multiple vias and low-
inductance connections. Parasitic inductance reduces
output power and efficiency, so place the ground return
of the chip components as close to the IC as possible.
The MAX2244 EV kit and MAX2246 EV kit PC boards use
via-on-pad for low-inductance connections.
Use a star connection for the power-supply traces that
connect to V
CC1
, V
CC2
, and RFOUT. At a common point
of the power-supply traces, connect 10nF and 10μF
decoupling capacitors to ground. Place 1nF capacitors
closer to the IC on each V
CC
trace with the small value
matching capacitors closest to the IC. The distance of
the matching capacitors from the IC is critical. See the
Power Supply Connections
section for more information.
The layout of the output section is important because
50
traces are used as part of the matching. See the
Output Matching
section for component information.
The 50
traces can be bent, but be aware of how the
characteristics of the transmission line change, and
compensate for them accordingly.
Use a 50
line to directly connect to the input. Place
one pad of the 1k
resistor for the
SHDN
signal directly
on the 50
line or as close to the line as possible. Any
trace connected to the 50
line changes the line
’
s
characteristic impedance, causing power loss. The lay-
out of the trace connecting PC is noncritical.
The chip-scale IC package uses a bump pitch of 0.5mm
(19.7 mil) and a bump diameter of 0.3mm (~12 mil).
Therefore, lay out the solder pad spacing on 0.5mm
(19.7 mil) centers. Use a pad size of 0.25mm (~10 mil)
and a solder mask opening of 0.33mm (13 mil). Round
or square pads are permissible. Refer to the Maxim
document,
Wafer Level Ultra-Chipscale Packaging,
for
detailed information on UCSP layout and handling.
Prototype Chip Installation
Alignment keys on the PC board around the chip are
helpful in prototype assembly. The MAX2244 and
MAX2246 EV kit PC boards have L-shaped alignment
keys at the diagonal corners of the chip. Align the chip
on the board before any other components are placed,
and place the board on a hotplate or hot surface until
the solder starts melting. Remove the board from the
hotplate without disturbing the position of the chip. Let
it cool to room temperature before further processing
the board.
Marking Information
UCSP Reliability
The UCSP is a unique package that greatly reduces
board space compared to other packages. UCSP relia-
bility is integrally linked to the user
’
s assembly methods,
circuit board material, and usage environment. Closely
review these areas when considering using a UCSP.
Performance through Operating Life Test and Moisture
Resistance remains uncompromised as they are primari-
ly determined by the wafer-fabrication process.
Mechanical stress performance is a greater considera-
tion for a UCSP. UCSP solder-joint contact integrity must
be considered because the package is attached through
direct solder contact to the user
’
s PC board. Testing to
characterize the UCSP reliability performance shows that
it is capable of performing reliably through environmental
stresses. Results of environmental stress tests and addi-
tional usage data and recommendations are detailed in
the UCSP application note, available on Maxim
’
s web-
site, www.maxim-ic.com.
Users should also be aware that, as with any intercon-
nect system there are electromigration-based current
limits that, in this case, apply to the maximum allowable
current in the bumps. Reliability is a function of this cur-
rent, the duty cycle, lifetime, and bump temperature. See
the
Absolute Maximum Ratings
section for any specific
limitations, listed under Continuous Operating Lifetime.
Chip Information
TRANSISTOR COUNT: 727
PROCESS: Bipolar
M
2.5GHz, 22dBm/20dBm Power Amplifiers with
Analog Closed-Loop Power Control
______________________________________________________________________________________
13
A A A
X X X
Pin 1 ID
AAA: Product ID Code
XXX: Lot Code
A1
PC
RFIN/
SHDN
B1
C1
A2
B2
C2
A3
B3
C3
V
CC2
GND
GND
RFOUT
V
CC1
GND
GND
A
B
C
1
2
3
TOP VIEW
(BUMPS AT THE BOTTOM)
UCSP
Pin Configuration
相关PDF资料 |
PDF描述 |
|---|---|
| MAX2244-MAX2246 | 2.5GHz, 22dBm/20dBm Power Amplifiers with Analog Closed-Loop Power Control |
| MAX2291NCDMAEVKIT | Evaluation Kit |
| MAX2291 | Evaluation Kit |
| MAX2291TDMAEVKIT | Circular Connector; No. of Contacts:6; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:9; Circular Contact Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:9-35 RoHS Compliant: No |
| MAX2291WCDMAEVKIT | Circular Connector; No. of Contacts:6; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:9; Circular Contact Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:9-35 RoHS Compliant: No |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX2244EBL | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX2244EBL-T | 功能描述:射频放大器 RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| MAX2244EBL-T10 | 功能描述:射频放大器 RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| MAX2244EVKIT | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:Evaluation Kit for the MAX2244/MAX2245/MAX2246 |
| MAX2244-MAX2246 | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:2.5GHz, 22dBm/20dBm Power Amplifiers with Analog Closed-Loop Power Control |
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