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参数资料
| 型号： | MAX2374EBT |
| 厂商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分类： | 衰减器 |
| 英文描述： | SiGe, Variable IIP3, Low-Noise Amplifier in UCSP Package |
| 中文描述： | 750 MHz - 1000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封装： | UCSP, 6 PIN |
| 文件页数： | 6/8页 |
| 文件大小： | 131K |
| 代理商： | MAX2374EBT |
M
SiGe, Variable IIP3, Low-Noise Amplifier
in UCSP Package
6
_______________________________________________________________________________________
Detailed Description
The MAX2374 SiGe LNA is packaged in a UCSP pack-
age in order to deliver high gain, high linearity, and low
noise in the smallest package possible. The special
feature of this LNA is that its linearity is adjusted by an
external resistor, R
BIAS
. The LNA has two digitally con-
trollable gain modes to increase system dynamic
range. Digital high at GAIN selects the high-gain mode,
and digital low selects the low-gain mode.
Adjust the LNA bias current to control the amplifier’s lin-
earity. The resistor R
BIAS
connected between BIAS and
V
CC
controls the LNA current. The amplifier’s linearity is
directly related to the operating current. Increasing the
bias current of the LNA increases the IIP3. V
BIAS
is
approximately constant at V
CC
- 1.16V. Connecting a
resistor from BIAS to V
CC
results in a supply current
that can be calculated as follows:
V
CC
= (High Gain) ~
–
(150 - 1.16V) / R
BIAS
I
BIAS
can be set by a fixed resistor to V
CC
as described
above, or it can be generated with a switched network.
To operate the LNA in high-gain/high-linearity mode,
set R
BIAS
= 20k
and drive GAIN high. Do this in the
presence of a transmit signal to minimize cross-modu-
lation. To operate the LNA in low-gain/low-linearity
mode, set R
BIAS
= 43k
and drive GAIN high. This
mode draws less current and should be used in the
absence of a transmit signal (paging mode). Shutdown
of the IC is accomplished by switching R
BIAS
to open
circuit.
Layout Issues
Design the layout for the IC to be as compact as possi-
ble to minimize the parasitics. The chip-scale IC pack-
age uses a bump pitch of 0.5mm (19.7mil) and bump
diameter of 0.3mm (~12mil). Therefore, lay out the sol-
der-pad spacing on 0.5mm (19.7mil) centers, using a
pad size of 0.25mm (~10mil) and a solder mask open-
ing of 0.33mm (13mil). Round or square pads are per-
missible. Connect multiple vias from the ground plane
as close to the ground pins as possible.
Install capacitors as close as possible to the IC supply
voltage pin and supply end of the series inductor.
Place the ground end of these capacitors near the IC
GND pins to provide a low-impedance return path for
the signal current.
Prototype Chip Installation
Alignment keys on the PC board around the area where
the chip is located will be helpful in the prototype
assembly process. It is better to align the chip on the
board before any other components are placed, and
then place the board on a hot plate or hot surface until
the solder starts melting. Remove the board from the
hot plate without disturbing the position of the chip, and
let it cool down to room temperature before processing
the board further.
UCSP Reliability
The ultra-chip-scale package (UCSP) represents a
unique packaging form factor that may not perform
equally well as a packaged product through traditional
mechanical reliability tests. UCSP reliability is integrally
linked to the user’s assembly methods, circuit board
material, and usage environment. The user should
closely review these areas when considering use of a
UCSP package.
Performance through operating-life test and moisture
resistance remains uncompromised as it is primarily
determined by the wafer-fabrication process.
Mechanical stress performance is a greater considera-
tion for UCSP packages. UCSPs are attached through
direct solder contact to the user’s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be consid-
ered. Comprehensive reliability tests have been per-
formed and are available upon request. In conclusion,
the UCSP performs reliably through environmental
stresses.
Marking Information
MAX2374
UCSP
TOP VIEW
(BUMPS ON BOTTOM)
BIAS
B3
V
CC
B2
LNAOUT
B1
LNAIN
GAIN
A3
GND
A2
A1
Pin Configuration
A A A
A A A
ORIENTATION
PRODUCT ID CODE
LOT CODE
TRANSISTOR COUNT: 296
Chip Information
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相关代理商/技术参数 |
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| MAX2374EBT+ | 制造商:Maxim Integrated Products 功能描述:- Rail/Tube |
| MAX2374EBT+T | 制造商:Maxim Integrated Products 功能描述:RF AMP CHIP SGL GP 1GHZ 5.5V 6UCSP - Tape and Reel |
| MAX2374EBT-T | 功能描述:射频放大器 RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| MAX2374EVKIT | 功能描述:射频开发工具 RoHS:否 制造商:Taiyo Yuden 产品:Wireless Modules 类型:Wireless Audio 工具用于评估:WYSAAVDX7 频率: 工作电源电压:3.4 V to 5.5 V |
| MAX237C/D | 功能描述:RS-232接口集成电路 RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装: |
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