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| 型号： | MAX2661EUT+T |
| 厂商： | Maxim Integrated |
| 文件页数： | 13/16页 |
| 文件大小： | 0K |
| 描述： | IC UPCONVERTER SOT23-6 |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| RF 型： | 手机，ISM，PCS，WLAN |
| 频率： | 400MHz ~ 2.5GHz |
| 混频器数目： | 1 |
| 增益： | 8.2dB |
| 噪音数据： | 11.9dB |
| 次要属性： | 升频器 |
| 电流 - 电源： | 8.3mA |
| 电源电压： | 2.7 V ~ 5.5 V |
| 包装： | 带卷 (TR) |
| 封装/外壳： | SOT-23-6 |
| 供应商设备封装： | SOT-6 |
400MHz to 2.5GHz Upconverter Mixers
_______________Detailed Description
The MAX2660/MAX2661/MAX2663/MAX2671/MAX2673
are 2.5GHz double-balanced upconverter mixers
designed to provide optimum linearity performance for
a specified supply current. These upconverter mixers
use single-ended RF, LO, and IF port connections,
except for the MAX2673, which uses a differential IF
port. An on-chip bias cell provides a low-power shut-
down feature. See the Selector Guide for device fea-
tures and comparison.
__________Applications Information
Local-Oscillator (LO) Input
The LO input is a single-ended broadband port with a
return loss of better than 8dB from 600MHz to 2.5GHz.
The LO signal is mixed with the input IF signal, and the
resulting upconverted output appears on the RFOUT
pin. AC-couple the LO pin with a capacitor having less
than 3 ? reactance at the LO frequency. The
MAX2671/MAX2673 include an internal LO buffer and
require an LO signal ranging from -10dBm to +5dBm,
while the MAX2660/MAX2661/MAX2663 require an LO
signal ranging from -5dBm to +2dBm.
IF Input
The MAX2660/MAX2661/MAX2663/MAX2671 have a
single-ended IF input port, while the MAX2673 has a
differential IF input port for high-performance interface-
to-differential IF filters. AC-couple the IF pin(s) with a
capacitor. The typical IF input frequency range is
40MHz to 500MHz. For further information, see the IF
Port Impedance vs. IF Frequency graph in the Typical
Operating Characteristics.
RF Output
The RF output frequency range extends from 400MHz
to 2.5GHz. RFOUT is a high-impedance, open-collector
output that requires an external inductor to V CC for
proper biasing. For optimum performance, implement
an impedance-matching network. The configuration
and values for the matching network depend on the fre-
quency, performance, and desired output impedance.
For assistance in choosing components for optimal per-
formance, see Table 1 as well as the RF Output
Impedance vs. RF Frequency graph in the Typical
Operating Characteristics .
Power Supply and S H D N Bypassing
Proper attention to supply bypassing is essential for a
high-frequency RF circuit. Bypass V CC with a 10μF
capacitor in parallel with an RF capacitor (Table 2). Use
separate vias to the ground plane for each of the
bypass capacitors and minimize trace length to reduce
inductance. Use separate vias to the ground plane for
each ground pin. Use low-inductance ground connec-
tions.
Decouple SHDN with a 100pF capacitor to ground to
minimize noise on the internal bias cell. Use a series
resistor (typically 100 ? ) to reduce coupling of high-fre-
quency signals into the SHDN pin.
______________________Layout Issues
A well-designed PC board is an essential part of an RF
circuit. For best performance, pay attention to power-
supply issues as well as to the layout of the RFOUT
matching network.
Power-Supply Layout
To minimize coupling between different sections of the
IC, the ideal power-supply layout is a star configuration
with a large decoupling capacitor at a central V CC
node. The V CC traces branch out from this central
node, each going to a separate V CC node in the PC
board. At the end of each trace is a bypass capacitor
that has low ESR at the RF frequency of operation. This
arrangement provides local decoupling at each V CC
pin. At high frequencies, any signal leaking out of one
supply pin sees a relatively high impedance (formed by
the V CC trace inductance) to the central V CC node, and
an even higher impedance to any other supply pin, as
well as a low impedance to ground through the bypass
capacitor.
Impedance-Matching Network Layout
The RFOUT matching network is very sensitive to lay-
out-related parasitics. To minimize parasitic induc-
tance, keep all traces short and place components as
close as possible to the chip. To minimize parasitic
capacitance, use cutouts in the ground plane (and any
other plane) below the matching network components.
______________________________________________________________________________________
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX2661EVKIT | 功能描述:射频开发工具 MAX2660/61/63/71 Eval Kit RoHS:否 制造商:Taiyo Yuden 产品:Wireless Modules 类型:Wireless Audio 工具用于评估:WYSAAVDX7 频率: 工作电源电压:3.4 V to 5.5 V |
| MAX2661EVKIT+ | 功能描述:射频开发工具 MAX2660/61/63/71 Eval Kit RoHS:否 制造商:Taiyo Yuden 产品:Wireless Modules 类型:Wireless Audio 工具用于评估:WYSAAVDX7 频率: 工作电源电压:3.4 V to 5.5 V |
| MAX2663EUT | 制造商:Maxim Integrated Products 功能描述:- Rail/Tube |
| MAX2663EUT+ | 制造商:Maxim Integrated Products 功能描述:UP/DOWN CONV MIXER 3.3V/5V 2.5GHZ 6PIN SOT-23 - Rail/Tube |
| MAX2663EUT+T | 功能描述:上下转换器 400MHz to 2.5GHz Upconverter RoHS:否 制造商:Texas Instruments 产品:Down Converters 射频:52 MHz to 78 MHz 中频:300 MHz LO频率: 功率增益: P1dB: 工作电源电压:1.8 V, 3.3 V 工作电源电流:120 mA 最大功率耗散:1 W 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PQFP-128 |
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