参数资料
型号: MAX2694EWS+T
厂商: Maxim Integrated
文件页数: 7/11页
文件大小: 0K
描述: IC RF LNA GPS/GNSS 4WLP
标准包装: 2,500
频率: 1575.42MHz
P1dB: -2.25dBm
增益: 11.6dB
噪音数据: 0.97dB
RF 型: GPS/GNSS
电源电压: 1.6 V ~ 3.6 V
电流 - 电源: 4.5mA
测试频率: 1575.42MHz
封装/外壳: 4-WFBGA,WLCSP
包装: 带卷 (TR)
MAX2687/MAX2689/MAX2694
GPS/GNSS Low-Noise Amplifiers
Bump Configuration
TOP VIEW
+
MAX2687
MAX2689
MAX2694
V CC
RFIN
A1
B1
A2
B2
RFOUT (SHDN)
GND
WLP
Bump Description
BUMP
A1
A2
B1
B2
NAME
V CC
RFOUT
( SHDN )
RFIN
GND
FUNCTION
Supply Voltage. Bypass to ground with a 10pF capacitor as close as possible to the IC.
RF Output/ SHDN Input. RFOUT is internally matched to 50 I and pulled up to V CC through a 1M I
resistor. SHDN is shared with the RFOUT bump. The devices are in active mode by default once
V CC is applied. RFOUT( SHDN ) can be pulled to a DC low through a 25k I resistor to shut down
the IC.
RF Input. Requires a DC-blocking capacitor and external matching components.
Ground. Connect to the PCB ground plane.
Detailed Description
The MAX2687/MAX2689/MAX2694 are LNAs designed
for GPS L1, Galileo, and GLONASS applications. The
devices feature an optional power-shutdown control
mode to eliminate the need for an external supply switch.
The devices achieve high gain, low noise figure, and
excellent linearity.
Input and Output Matching
The devices require an off-chip input matching. Only
an inductor in series with a DC-blocking capacitor is
needed to form the input matching circuit. The Typical
Application Circuit shows the recommended input-
matching network. These values are optimized for the
best simultaneous gain, noise figure, and return loss
performance. The value of the input coupling capacitor
Maxim Integrated
affects IIP3. A smaller coupling capacitor results in lower
IIP3. The devices integrate an on-chip output matching
to 50 I at the output, eliminating the need for external
matching components. Tables 1 and 2 list typical device
S parameters and K f values. Typical noise parameters
are shown in Tables 3 and 4.
Shutdown
The devices include an optional shutdown feature to
turn off the entire chip. The devices are placed in active
mode by default once V CC is applied, due to the on-chip
pullup resistor to V CC at the RFOUT bump (shared with
the SHDN input). To shut down the part, apply a logic-
low to the RFOUT bump through an external resistor with
an adequate value, e.g., 25k I , in order not to load the
RF output signal during active operation.
7
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