参数资料
型号: MAX3023EUD+T
厂商: Maxim Integrated Products
文件页数: 7/18页
文件大小: 0K
描述: IC TRANSLATOR LVL 100MBPS 14TSSO
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
逻辑功能: 变换器,双向,3 态
位数: 4
输入类型: 逻辑
输出类型: 逻辑
数据速率: 100Mbps
通道数: 4
输出/通道数目: 1
差分 - 输入:输出: 无/无
传输延迟(最大): 6ns
电源电压: 1.65 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 14-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 14-TSSOP
包装: 带卷 (TR)
MAX13013/MAX13014/MAX3023
+1.2V to +3.6V, 0.1A, 100Mbps,
Single-/Dual-/Quad-Level Translators
______________________________________________________________________________________
15
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
SOT23,
8L
.EPS
REV.
DOCUMENT CONTROL NO.
APPROVAL
PROPRIETARY INFORMATION
TITLE:
3.00
2.60
E
C
E1
E
BETWEEN 0.08mm AND 0.15mm FROM LEAD TIP.
8. MEETS JEDEC MO178.
8∞
0.60
1.75
0.30
L2
0∞
e1
e
L
1.50
E1
0.65 BSC.
1.95 REF.
0.25 BSC.
GAUGE PLANE
SEATING PLANE C
C
L
PIN 1
I.D. DOT
(SEE NOTE 6)
L
C
L
C
A2
e1
D
DETAIL "A"
5. COPLANARITY 4 MILS. MAX.
NOTE:
7. SOLDER THICKNESS MEASURED AT FLAT SECTION OF LEAD
6. PIN 1 I.D. DOT IS 0.3 MM MIN. LOCATED ABOVE PIN 1.
4. PACKAGE OUTLINE INCLUSIVE OF SOLDER PLATING.
3. PACKAGE OUTLINE EXCLUSIVE OF MOLD FLASH & METAL BURR.
HEEL OF THE LEAD PARALLEL TO SEATING PLANE C.
2. FOOT LENGTH MEASURED FROM LEAD TIP TO UPPER RADIUS OF
1. ALL DIMENSIONS ARE IN MILLIMETERS.
L2
L
A1
A
0.45
1.30
0.15
1.45
MAX
0.28
b
0.90
A2
0.00
A1
0.90
A
MIN
SYMBOL
3.00
0.20
2.80
D
0.09
C
SEE DETAIL "A"
L
C
b
e
D
1
21-0078
1
PACKAGE OUTLINE, SOT-23, 8L BODY
0
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