参数资料
型号: MAX3221ECDB
厂商: Texas Instruments
文件页数: 14/19页
文件大小: 0K
描述: IC RS232 3V-5.5V DRVR 16-SSOP
标准包装: 80
类型: 收发器
驱动器/接收器数: 1/1
规程: RS232
电源电压: 3 V ~ 5.5 V
安装类型: 表面贴装
封装/外壳: 16-SSOP(0.209",5.30mm 宽)
供应商设备封装: 16-SSOP
包装: 管件
其它名称: 296-33363-5
MAX3221ECDB-ND
www.ti.com
Electrical Characteristics
(1)
Driver Section Electrical Characteristics
(1)
Driver Section Switching Characteristics
(1)
3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVER
WITH 15-kV IEC ESD PROTECTION
SLLS686A – OCTOBER 2005 – REVISED MAY 2006
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
MIN
TYP(2) MAX
UNIT
FORCEOFF,
II
Input leakage current
±0.01
±1
A
FORCEON, EN
No load,
Auto-powerdown
FORCEOFF and
0.3
1
mA
disabled
FORCEON at VCC
VCC = 3.3 V or 5 V,
No load,
ICC
Supply current
Powered off
1
10
TA = 25°C
FORCEOFF at GND
A
No load, FORCEOFF at VCC,
Auto-powerdown
FORCEON at GND,
1
10
enabled
All RIN are open or grounded
(1)
Test conditions are C1–C4 = 0.1
F at V
CC = 3.3 V ± 0.3 V; C1 = 0.047 F, C2–C4 = 0.33 F at VCC = 5 V ± 0.5 V.
(2)
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
MIN
TYP(2)
MAX
UNIT
VOH
High-level output voltage
DOUT at RL = 3 k to GND,
DIN = GND
5
5.4
V
VOL
Low-level output voltage
DOUT at RL = 3 k to GND,
DIN = VCC
–5
–5.4
V
IIH
High-level input current
VI = VCC
±0.01
±1
A
IIL
Low-level input current
VI = GND
±0.01
±1
A
VCC = 3.6 V,
VO = 0 V
±35
±60
Short-circuit
IOS
mA
output current(3)
VCC = 5.5 V,
VO = 0 V
±35
±60
ro
Output resistance
VCC, V+, and V– = 0 V,
VO = ±2 V
300
10M
VO = ±12 V,
VCC = 3 V to 3.6 V
±25
Ioff
Output leakage current
FORCEOFF = GND
A
VO = ±10 V,
VCC = 4.5 V to 5.5 V
±25
(1)
Test conditions are C1–C4 = 0.1
F at V
CC = 3.3 V ± 0.3 V; C1 = 0.047 F, C2–C4 = 0.33 F at VCC = 5 V ± 0.5 V.
(2)
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3)
Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one
output should be shorted at a time.
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
MIN
TYP(2)
MAX
UNIT
Maximum data rate
CL = 1000 pF,
RL = 3 k,
150
250
kbit/s
tsk(p)
Pulse skew(3)
CL = 150 pF to 2500 pF, RL = 3 k to 7 k,
100
ns
Slew rate,
CL = 150 pF to 1000 pF
6
30
VCC = 3.3 V,
SR(tr)
transition region
V/
s
RL = 3 k to 7 k
CL = 150 pF to 2500 pF
4
30
(see Figure 1)
(1)
Test conditions are C1–C4 = 0.1
F at V
CC = 3.3 V ± 0.3 V; C1 = 0.047 F, C2–C4 = 0.33 F at VCC = 5 V ± 0.5 V.
(2)
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3)
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
4
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