参数资料
型号: MAX3241ECAI
厂商: Maxim Integrated Products
文件页数: 7/22页
文件大小: 0K
描述: IC TXRX RS232 1MBPS 28-SSOP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 46
类型: 收发器
驱动器/接收器数: 3/5
规程: RS232
电源电压: 3 V ~ 5.5 V
安装类型: 表面贴装
封装/外壳: 28-SSOP(0.209",5.30mm 宽)
供应商设备封装: 28-SSOP
包装: 管件
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
Figure 6a shows the transmitter output voltages under
increasing load current at +3.0V. Figure 6b shows a
typical mouse connection using the MAX3241E.
High Data Rates
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/
MAX3246E maintain the RS-232 ±5V minimum transmit-
ter output voltage even at high data rates. Figure 7
shows a transmitter loopback test circuit. Figure 8
shows a loopback test result at 120kbps, and Figure 9
shows the same test at 250kbps. For Figure 8, all trans-
mitters were driven simultaneously at 120kbps into RS-
232 loads in parallel with 1000pF. For Figure 9, a single
transmitter was driven at 250kbps, and all transmitters
were loaded with an RS-232 receiver in parallel with
1000pF.
The MAX3237E maintains the RS-232 ±5.0V minimum
transmitter output voltage at data rates up to 1Mbps.
Figure 10 shows a loopback test result at 1Mbps with
MBAUD = VCC. For Figure 10, all transmitters were
loaded with an RS-232 receiver in parallel with 250pF.
Interconnection with 3V and 5V Logic
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/
MAX3246E can directly interface with various 5V logic
families, including ACT and HCT CMOS. See Table 3
for more information on possible combinations of inter-
connections.
UCSP Reliability
The UCSP represents a unique packaging form factor
that may not perform equally to a packaged product
through traditional mechanical reliability tests. UCSP
reliability is integrally linked to the user’s assembly
methods, circuit board material, and usage environ-
ment. The user should closely review these areas when
considering use of a UCSP package. Performance
through Operating Life Test and Moisture Resistance
remains uncompromised as the wafer-fabrication
process primarily determines it.
Mechanical stress performance is a greater considera-
tion for a UCSP package. UCSPs are attached through
direct solder contact to the user’s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be consid-
ered. Table 4 shows the testing done to characterize
the UCSP reliability performance. In conclusion, the
UCSP is capable of performing reliably through envi-
ronmental stresses as indicated by the results in the
table. Additional usage data and recommendations are
detailed in Application Note 1891:
Wafer-Level
Packaging (WLP) and Its Applications.
Table 4. Reliability Test Data
TEST
CONDITIONS
DURATION
FAILURES PER
SAMPLE SIZE
Temperature Cycle
TA = -35°C to +85°C,
TA = -40°C to +100°C
150 cycles,
900 cycles
0/10,
0/200
Operating Life
TA = +70°C
240 hours
0/10
Moisture Resistance
TA = +20°C to +60°C, 90% RH
240 hours
0/10
Low-Temperature Storage
TA = -20°C
240 hours
0/10
Low-Temperature Operational
TA = -10°C
24 hours
0/10
Solderability
8-hour steam age
0/15
ESD
±15kV, Human Body Model
0/5
High-Temperature Operating
Life
TJ = +150°C
168 hours
0/45
Maxim Integrated
15
MAX3222E/MAX3232E/MAX3237E/
MAX3241E/MAX3246E
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相关代理商/技术参数
参数描述
MAX3241ECAI+ 功能描述:RS-232接口集成电路 3-5.5V 250kbps Transceiver RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装:
MAX3241ECAI+T 功能描述:RS-232接口集成电路 3-5.5V 250kbps Transceiver RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装:
MAX3241ECAI-T 功能描述:RS-232接口集成电路 RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装:
MAX3241ECGJ 功能描述:RS-232接口集成电路 RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装:
MAX3241ECGJ-T 功能描述:RS-232接口集成电路 RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装: