参数资料
型号: MAX3322EEUP+T
厂商: Maxim Integrated Products
文件页数: 1/13页
文件大小: 0K
描述: IC TXRX RS232 250KBPS 20TSSOP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
类型: 收发器
驱动器/接收器数: 2/2
规程: RS232
电源电压: 3 V ~ 5.5 V
安装类型: 表面贴装
封装/外壳: 20-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 20-TSSOP
包装: 带卷 (TR)
General Description
The MAX3322E/MAX3323E 3.0V to 5.5V powered
EIA/TIA-232 and V.28/V.24 communications interfaces
are designed for multidrop applications with low power
requirements, high data-rate capabilities, and
enhanced electrostatic discharge (ESD) protection. All
RS-232 inputs and outputs are protected to ±15kV
using the IEC 1000-4-2 Air-Gap Discharge method,
±8kV using the IEC 1000-4-2 Contact Discharge
method, and ±15kV using the Human Body Model.
The MAX3322E/MAX3323E have pin-selectable
5k
/high-impedance RS-232 receivers. These devices
are capable of receiving data in high-impedance mode.
In multidrop applications, one receiver has a 5k
input
resistance, while the other receivers are high imped-
ance to ensure the RS-232 standard is observed. Logic
control permits selection of the functional mode: high
impedance or RS-232 standard load. The transmitters
are enabled by logic control to allow the multiplexing of
the inputs to a single UART.
A proprietary low-dropout transmitter output stage
enables true RS-232 performance from a 3.0V to 5.5V
supply with a dual charge pump. The charge pump
requires only four small 0.1F capacitors for operation
from a 3.3V supply. The MAX3322E/MAX3323E are
capable of running at data rates up to 250kbps while
maintaining RS-232-compliant output levels. The
MAX3322E/MAX3323E have a unique VL pin that allows
operation in mixed-logic voltage systems. Both input
and output logic levels are pin programmable through
the VL pin.
The MAX3322E is a 2Tx/2Rx device for hardware hand-
shaking in standard RS-232 mode, and the MAX3323E
is a 1Tx/1Rx, required in most multidrop applications.
The MAX3322E is offered in a space-saving TSSOP
package. The MAX3323E is offered in 16-pin DIP and
space-saving TSSOP packages.
Applications
Bar-Code Scanners
Video Security
Industrial Data Acquisition
Data Splitters
Features
o Pin-Selectable 5k/High-Impedance Receivers
o Transmitter Outputs Three-Stated by Logic
Control
o VL Pin for Compatibility with Mixed Voltage
Systems
o 1Tx/1Rx (MAX3323E) or 2Tx/2Rx (MAX3322E)
Versions
o 250kbps Data Rate
o 1A Low-Power Shutdown
o High ESD Protection for RS-232 I/O Pins
±15kV—Human Body Model
±8kV—IEC 1000-4-2 Contact Discharge
±15kV—IEC 1000-4-2 Air-Gap Discharge
MAX3322E/MAX3323E
±15kV ESD-Protected, RS-232 Transceivers for
Multidrop Applications
________________________________________________________________ Maxim Integrated Products
1
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
VCC
GND
SHDN
VL
C2+
C1-
V+
C1+
TOP VIEW
RENABLE
TXENABLE
TIN2
ROUT2
RIN2
TOUT2
V-
C2-
12
11
9
10
TIN1
ROUT1
RIN1
TOUT1
MAX3322E
TSSOP
Pin Configurations
Ordering Information
19-2667; Rev 1; 1/03
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
PART
TEMP RANGE
PIN-PACKAGE
MAX3322E EUP
-40
°C to +85°C
20 TSSOP
MAX3323E EUE
-40
°C to +85°C
16 TSSOP
MAX3323EEPE
-40
°C to +85°C
16 DIP
Pin Configurations continued at end of data sheet.
Typical Operating Circuit and Functional Diagram appear
at end of data sheet.
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相关代理商/技术参数
参数描述
MAX3323EEPE 功能描述:RS-232接口集成电路 RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装:
MAX3323EEPE+ 功能描述:RS-232接口集成电路 Transceiver For Multidrop Aps RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装:
MAX3323EEUE 功能描述:RS-232接口集成电路 RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装:
MAX3323EEUE/GH9 制造商:Maxim Integrated Products 功能描述:- Rail/Tube
MAX3323EEUE+ 功能描述:RS-232接口集成电路 Transceiver For Multidrop Aps RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装: