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| 型号： | MAX333CPP-2 |
| 厂商： | Maxim Integrated Products, Inc. |
| 英文描述： | SPDT Analog Switch |
| 中文描述： | SPDT模拟开关 |
| 文件页数： | 13/17页 |
| 文件大小： | 389K |
| 代理商： | MAX333CPP-2 |
M
±15kV ESD-Protected USB Transceiver
in UCSP
___________________________________________________________________________________________________
13
13
IEC 1000-4-2
The IEC 1000-4-2 standard covers ESD testing and
performance of finished equipment; it does not specifi-
cally refer to integrated circuits. The MAX3346E helps
to design equipment that meets Level 2 of IEC 1000-4-
2, without the need for additional ESD-protection com-
ponents.
The major difference between tests done using the
Human Body Model and IEC 1000-4-2 is a higher peak
current in IEC 1000-4-2, because series resistance is
lower in the IEC 1000-4-2 model. Hence, the ESD with-
stand voltage measured to IEC 1000-4-2 is generally
lower than that measured using the Human Body Model.
Figure 7a shows the IEC 1000-4-2 model.
The Air-Gap Discharge test involves approaching the
device with a charged probe. The Contact Discharge
method connects the probe to the device before the
probe is energized.
Machine Model
The Machine Model for ESD tests all pins using a 200pF
storage capacitor and zero discharge resistance. Its
objective is to emulate the stress caused by contact that
occurs with handling and assembly during manufactur-
ing. Of course, all pins require this protection during
manufacturing, not just USB inputs and outputs.
Therefore, after PC board assembly, the Machine Model
is less relevant to I/O ports.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit board
techniques, bump-pad layout, and recommended reflow
temperature profile as well as the latest information on
reliability testing results, go to the Maxim website at
www.maxim-ic.com/ucsp for the Application Note,
“UCSP—A Wafer-Level Chip-Scale Package.”
CHARGE-CURRENT
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Cs
150pF
R
C
50M
to 100M
R
D
330
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
Figure 7a. IEC 1000-4-2 ESD Test Model
相关PDF资料 |
PDF描述 |
|---|---|
| MAX333CWP-TR | SPDT Analog Switch |
| MAX3353E | USB On-the-Go Charge Pump with Switchable Pullup/Pulldown Resistors |
| MAX3355E | ?5kV ESD-Protected USB On-the-Go Charge Pump and Comparators in UCSP |
| MAX3371 | ±.15kV ESD-Protected.0.5µ.A.+3V to 5.5V.1.5Mbps RS-232 Receivers in SOT23 5[MAX3180E/MAX3181E/MAX3182E/MAX3183E/MAX3180EEUK-T/MAX3181EEUK-T/MAX3182EEUK-T/MAX3183EEUK-T ] |
| MAX3373E | ±.15kV ESD-Protected.1µ.A.16Mbps.Dual/Quad Low-Voltage Level Translators in UCSP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX333CWP | 功能描述:模拟开关 IC RoHS:否 制造商:Texas Instruments 开关数量:2 开关配置:SPDT 开启电阻（最大值）:0.1 Ohms 切换电压（最大）: 开启时间（最大值）: 关闭时间（最大值）: 工作电源电压:2.7 V to 4.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-16 |
| MAX333CWP+ | 功能描述:模拟开关 IC Quad SPST NO CMOS RoHS:否 制造商:Texas Instruments 开关数量:2 开关配置:SPDT 开启电阻（最大值）:0.1 Ohms 切换电压（最大）: 开启时间（最大值）: 关闭时间（最大值）: 工作电源电压:2.7 V to 4.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-16 |
| MAX333CWP+T | 功能描述:模拟开关 IC Quad SPST NO CMOS RoHS:否 制造商:Texas Instruments 开关数量:2 开关配置:SPDT 开启电阻（最大值）:0.1 Ohms 切换电压（最大）: 开启时间（最大值）: 关闭时间（最大值）: 工作电源电压:2.7 V to 4.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-16 |
| MAX333CWP-T | 功能描述:模拟开关 IC RoHS:否 制造商:Texas Instruments 开关数量:2 开关配置:SPDT 开启电阻（最大值）:0.1 Ohms 切换电压（最大）: 开启时间（最大值）: 关闭时间（最大值）: 工作电源电压:2.7 V to 4.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-16 |
| MAX333EAP | 功能描述:模拟开关 IC RoHS:否 制造商:Texas Instruments 开关数量:2 开关配置:SPDT 开启电阻（最大值）:0.1 Ohms 切换电压（最大）: 开启时间（最大值）: 关闭时间（最大值）: 工作电源电压:2.7 V to 4.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-16 |
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