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参数资料
| 型号： | MAX3355EEUD+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 9/11页 |
| 文件大小： | 0K |
| 描述： | IC CHARGE PUMP USB OTG 14TSSOP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 应用： | 充电泵，USB |
| 输入电压： | 2.6 V ~ 5.5 V |
| 输出数： | 1 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 14-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 14-TSSOP |
| 包装： | 带卷 (TR) |
±15kV ESD-Protected USB On-the-Go
Charge Pump and Comparators in UCSP
IEC 1000-4-2 is generally lower than that measured
using the Human Body Model. Figure 3 shows the IEC
1000-4-2 model. The Air-Gap Discharge test involves
approaching the device with a charged probe. The
contact-discharge method connects the probe to the
device before the probe is energized.
Machine Model
The Machine Model for ESD tests all pins using a
200pF storage capacitor and zero discharge resis-
tance. Its objective is to emulate the stress caused by
contact that occurs with handling and assembly during
manufacturing. All pins require this protection during
manufacturing. After PC board assembly, the Machine
Model is less relevant to I/O ports.
Layout Considerations
The MAX3355E charge-pump switching frequency
makes proper layout important to ensure stability and
maintain the output voltage under all loads. For best
performance, minimize the distance between the
capacitors and the MAX3355E.
UCSP Applications Information
For the latest application details on UCSP construc-
tion, dimensions, tape-carrier information, printed cir-
cuit board techniques, bump-pad layout, and
recommended reflow temperature profile, as well as
the latest information on reliability testing results, refer
to Maxim Application Note: UCSP –A Wafer-Level
Chip-Scale Package available on Maxim ’ s web site at
www.maxim-ic.com/ucsp.
Pin Configurations
TOP VIEW
TOP VIEW
1
2
3
4
V BUS 1
14 C+
MAX3355E
V CC
ID_OUT
2
3
13 C-
12 GND
A
V CC
ID_OUT STATUS1 STATUS2
OFFVBUS 4
MAX3355E
11 SHDN
V BUS
OFFVBUS
SHDN
V L
STATUS1 5
10 ID_IN
B
STATUS2 6
9
V L
C+
C-
GND
ID_IN
N.C. 7
TSSOP
8
N.C.
C
UCSP
Chip Information
TRANSISTOR COUNT: 1601
PROCESS: BiCMOS
_______________________________________________________________________________________
9
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX335C/D | 功能描述:模拟开关 IC Serial Controlled 8-Channel SPST Switch RoHS:否 制造商:Texas Instruments 开关数量:2 开关配置:SPDT 开启电阻（最大值）:0.1 Ohms 切换电压（最大）: 开启时间（最大值）: 关闭时间（最大值）: 工作电源电压:2.7 V to 4.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-16 |
| MAX335CNG | 功能描述:模拟开关 IC RoHS:否 制造商:Texas Instruments 开关数量:2 开关配置:SPDT 开启电阻（最大值）:0.1 Ohms 切换电压（最大）: 开启时间（最大值）: 关闭时间（最大值）: 工作电源电压:2.7 V to 4.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-16 |
| MAX335CNG+ | 功能描述:模拟开关 IC Serial Controlled 8Ch SPST Switch RoHS:否 制造商:Texas Instruments 开关数量:2 开关配置:SPDT 开启电阻（最大值）:0.1 Ohms 切换电压（最大）: 开启时间（最大值）: 关闭时间（最大值）: 工作电源电压:2.7 V to 4.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-16 |
| MAX335CWG | 功能描述:模拟开关 IC RoHS:否 制造商:Texas Instruments 开关数量:2 开关配置:SPDT 开启电阻（最大值）:0.1 Ohms 切换电压（最大）: 开启时间（最大值）: 关闭时间（最大值）: 工作电源电压:2.7 V to 4.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-16 |
| MAX335CWG+ | 功能描述:模拟开关 IC Serial Controlled 8Ch SPST Switch RoHS:否 制造商:Texas Instruments 开关数量:2 开关配置:SPDT 开启电阻（最大值）:0.1 Ohms 切换电压（最大）: 开启时间（最大值）: 关闭时间（最大值）: 工作电源电压:2.7 V to 4.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-16 |
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