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参数资料
| 型号： | MAX338MJE |
| 厂商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分类： | 运动控制电子 |
| 英文描述： | ANALOG MUX|SINGLE|8-CHANNEL|CMOS|DIP|16PIN|CERAMIC |
| 中文描述： | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16 |
| 封装： | 0.300 INCH, CERAMIC, DIP-16 |
| 文件页数： | 13/17页 |
| 文件大小： | 389K |
| 代理商： | MAX338MJE |
M
±15kV ESD-Protected USB Transceiver
in UCSP
___________________________________________________________________________________________________
13
13
IEC 1000-4-2
The IEC 1000-4-2 standard covers ESD testing and
performance of finished equipment; it does not specifi-
cally refer to integrated circuits. The MAX3346E helps
to design equipment that meets Level 2 of IEC 1000-4-
2, without the need for additional ESD-protection com-
ponents.
The major difference between tests done using the
Human Body Model and IEC 1000-4-2 is a higher peak
current in IEC 1000-4-2, because series resistance is
lower in the IEC 1000-4-2 model. Hence, the ESD with-
stand voltage measured to IEC 1000-4-2 is generally
lower than that measured using the Human Body Model.
Figure 7a shows the IEC 1000-4-2 model.
The Air-Gap Discharge test involves approaching the
device with a charged probe. The Contact Discharge
method connects the probe to the device before the
probe is energized.
Machine Model
The Machine Model for ESD tests all pins using a 200pF
storage capacitor and zero discharge resistance. Its
objective is to emulate the stress caused by contact that
occurs with handling and assembly during manufactur-
ing. Of course, all pins require this protection during
manufacturing, not just USB inputs and outputs.
Therefore, after PC board assembly, the Machine Model
is less relevant to I/O ports.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit board
techniques, bump-pad layout, and recommended reflow
temperature profile as well as the latest information on
reliability testing results, go to the Maxim website at
www.maxim-ic.com/ucsp for the Application Note,
“UCSP—A Wafer-Level Chip-Scale Package.”
CHARGE-CURRENT
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Cs
150pF
R
C
50M
to 100M
R
D
330
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
Figure 7a. IEC 1000-4-2 ESD Test Model
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相关代理商/技术参数 |
参数描述 |
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| MAX338MSE/PR3 | 制造商:Maxim Integrated Products 功能描述:8-CHANNEL/DUAL 4-CHANNEL, LOW-LEAKAGE, CMOS ANALOG MULTIPLEX - Rail/Tube |
| MAX3390EEBC | 制造商:Maxim Integrated Products 功能描述:- Rail/Tube |
| MAX3390EEBC+T | 功能描述:转换 - 电压电平 RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| MAX3390EEBC-T | 功能描述:转换 - 电压电平 RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| MAX3390EEUD | 功能描述:转换 - 电压电平 RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
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