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参数资料
| 型号： | MAX3658AETA+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 14/15页 |
| 文件大小： | 0K |
| 描述： | IC AMP TRANSIMPEDANCE 8-TDFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 类型： | 转阻放大器 |
| 应用： | 光纤学网络 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-WDFN 裸露焊盘 |
| 供应商设备封装： | 8-TDFN-EP（3x3） |
| 包装： | 带卷 (TR) |
MAX3658
Select CCOUPLE so the low-frequency cutoff due to the
load resistors and coupling capacitors is much lower
than the low-frequency cutoff of the MAX3658. The cou-
pling capacitor should be 0.1F or larger for SONET
data. For lowest jitter, 1.0F is recommended. Refer to
application note HFAN-01.1:
Choosing AC-Coupling
Capacitors for a more detailed discussion on choosing
AC-coupling capacitors.
Select Output Filter
Input sensitivity is improved by adding a filter between
TIA and the quantizer/limiting amplifier, with 0.5pF input
capacitance. Typical bandwidth of the MAX3658 is
580MHz; the highest expected bandwidth is 730MHz.
Layout Considerations
Figure 3 shows suggested layouts for 4- and 5-pin TO
headers.
Wire Bonding
For high-current density and reliable operation, the
MAX3658 uses gold metalization. For best results, use
gold-wire ball-bonding techniques. Use caution when
wedge bonding. Die-size is 52 mils x 29 mils, (1.32mm
x 0.736mm) and die thickness is 15 mils (380m). The
bond-pad passivation opening is 75m and bond-pad
metal thickness is 5m. Refer to Maxim application note
HFAN-08.0.1:
Understanding Bonding Coordinates and
Physical Die Size for additional information on bond-
pad coordinates.
Applications Information
Optical Power Relations
Many of the MAX3658 specifications relate to the input
signal amplitude. When working with optical receivers,
the input is sometimes expressed in terms of average
optical power and extinction ratio. Figure 4 and Table 1
show relations that are helpful for converting optical
power to input signal when designing with the MAX3658.
Optical Sensitivity Calculation
The input-referred RMS noise current (in) of the
MAX3658 generally determines the receiver sensitivity.
To obtain a system bit-error rate (BER) of 1E-10, the
signal-to-noise ratio must always exceed 12.7. The
input sensitivity, expressed in average power, can be
estimated as:
SENSITIVITY
ir
r
dBm
ne
e
log
.
=
××
+
()
××
()
×
10
12 7
1
21
1000
ρ
622Mbps, Low-Noise, High-Gain
Transimpedance Preamplifier
8
_______________________________________________________________________________________
5-PIN HEADER
4-PIN HEADER
PHOTODIODE
MOUNTED ON CFILT
OUTPUT POLARITIES
REVERSED FOR MAX3658B
CASE IS GROUND
PHOTODIODE
MOUNTED ON CFILT
OUTPUT POLARITIES
REVERSED FOR MAX3658B
CASE IS GROUND
PHOTODIODE
GND
MAX3658A
FIL
T
IN
MON
PHOTODIODE
MAX3658A
FIL
T
IN
MON
CVCC1
VCC
OUT-
OUT+
VCC
OUT-
MON
OUT+
CVCC1
Figure 3. Suggested TO Header Layouts
Table 1. Optical Power Relations*
PARAMETER
SYMBOL
RELATION
Average Power
PAVG
P
PP
AVG
=
+
01
2
Extinction Ratio
re
r
P
e
=
1
0
Optical Power of a 1
P1
PP
r
AVG
e
12
1
=
+
Optical Power of a 0
P0
P
r
AVG
e
0
2
1
=
+
Optical Modulation
Amplitude
PIN
PP
P
r
IN
AVG
e
=
+
10
2
1
*
Assuming a 50% average mark density.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX3658AEVKIT | 制造商:Maxim Integrated Products 功能描述:622MBPS, LOW-NOISE, HIGH-GAIN TRANSIMPEDANCE - Bulk |
| MAX3658BE/D | 功能描述:特殊用途放大器 RoHS:否 制造商:Texas Instruments 通道数量:Single 共模抑制比（最小值）: 输入补偿电压: 工作电源电压:3 V to 5.5 V 电源电流:5 mA 最大功率耗散: 最大工作温度:+ 70 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-20 封装:Reel |
| MAX365C/D | 功能描述:模拟开关 IC RoHS:否 制造商:Texas Instruments 开关数量:2 开关配置:SPDT 开启电阻（最大值）:0.1 Ohms 切换电压（最大）: 开启时间（最大值）: 关闭时间（最大值）: 工作电源电压:2.7 V to 4.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-16 |
| MAX365CPE | 功能描述:模拟开关 IC RoHS:否 制造商:Texas Instruments 开关数量:2 开关配置:SPDT 开启电阻（最大值）:0.1 Ohms 切换电压（最大）: 开启时间（最大值）: 关闭时间（最大值）: 工作电源电压:2.7 V to 4.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-16 |
| MAX365CPE+ | 功能描述:模拟开关 IC RoHS:否 制造商:Texas Instruments 开关数量:2 开关配置:SPDT 开启电阻（最大值）:0.1 Ohms 切换电压（最大）: 开启时间（最大值）: 关闭时间（最大值）: 工作电源电压:2.7 V to 4.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-16 |
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